GlobalFoundries and TSMC agree on U.S. silicon interposer supply deal

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Go back to GlobalFoundries and TSMC agree on U.S. silicon interposer supply deal

GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging

October 8, 2026 8:10 AM EDT

MALTA, N.Y., Oct. 08, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC's CoWoS® advanced packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems. The agreement provides a foundation to expand capacity over time as customer demand grows.

GF expects to expand capacity at its Malta facility and establish the first U.S.-based source of... More