Lumentum, Qualcomm, and Corning to show optical AI interconnect

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Go back to Lumentum, Qualcomm, and Corning to show optical AI interconnect

Lumentum, Qualcomm, and Corning to Demonstrate High-Density 1060 nm VCSEL Optical D2D Connectivity for AI Scale-Up at ECOC 2026

September 21, 2026 5:07 AM EDT

Joint demonstration showcases a massively parallel optical die-to-die architecture designed to extend high-bandwidth, low-power, low-latency connectivity over multimode fiber

MALAGA, Spain--(BUSINESS WIRE)-- Lumentum Holdings Inc. (Lumentum) today announced plans for a joint demonstration together with Qualcomm Technologies, Inc. and Corning Incorporated (NYSE: GLW) of a high-density die-to-die (D2D) optical interconnect showcase for AI scale-up architectures at ECOC 2026. The board-level demonstration will combine a D2D interface IP subsystem from Qualcomm Technologies with Lumentums VCSEL-based optical interconnect platform and Corning multimode fiber connectivity. Attendees can see the demonstration at Lumentum stand... More