Qnity launches advanced packaging materials for organic interposers
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Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications
June 8, 2026 4:15 PM EDTWILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia 8540HSP multi-role copper and Cyclotene DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate structures.
AI is fundamentally changing how chips are packagedand materials have to evolve just as fast, said Chuck Xu, President of Interconnect Solutions at Qnity. As architectures move from shrinking to stacking,... More
