Navitas launches isolated package for SiC MOSFETs with thermal management
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Navitas Introduces Isolated Through-Hole Package for SiC MOSFETs, Enabling Direct-Cooled Thermal Management
June 8, 2026 8:30 AM EDTDirect-cooled thermal management offered by a reflow-compatible, isolated thermal pad significantly improves power density, reliability, and efficiency.Integrated aluminum nitride substrate-based isolation reduces electromagnetic coupling, allowing higher switching speeds and lower EMI management costs.Developed for 3300V, 2300V, and 1200V SiC MOSFET products.
TORRANCE, Calif., June 08, 2026 (GLOBE NEWSWIRE) --... More
