ASE develops automated 310mm panel packaging line for AI chips
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ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation
May 26, 2026 9:00 AM EDTDriving performance, scalability, and efficiency for next-generation compute workloads
SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge... More
