Applied Materials launches systems for 2nm chip manufacturing
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Applied Materials Introduces Deposition Systems for Angstrom-Era Logic Chips
April 8, 2026 9:00 AM EDTChipmaking systems create the smallest atomic-scale features in 3D Gate-All-Around transistorsPrecision Selective Nitride PECVD preserves integrity of shallow trench isolation, reducing parasitic capacitance and boosting chip performance-per-wattTrillium ALD wraps silicon nanosheets with complex metal gate stacks that optimize transistors for a wide range of AI computing applicationsThe new systems are being used by leading foundry-logic manufacturers at 2nm and beyond
SANTA CLARA, Calif., April 08, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today introduced two chipmaking systems... More
