Applied Materials (AMAT) Unveils Chip Wiring Innovations
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Applied Materials Unveils Chip Wiring Innovations for More Energy-Efficient Computing
July 8, 2024 7:31 AM EDTIndustrys first use of ruthenium in high-volume production enables copper chip wiring to be scaled to the 2nm node and beyond and reduces resistance by as much as 25%New enhanced low-k dielectric material reduces chip capacitance and strengthens logic and DRAM chips for 3D stacking
SANTA CLARA, Calif., July 08, 2024 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced materials engineering innovations designed to increase the performance-per-watt of computer systems by enabling copper wiring to scale to the 2nm logic node and beyond.
The AI era needs more energy-efficient computing, and chip wiring... More
