GlobalFoundries and TSMC agree on U.S. silicon interposer supply deal

GlobalFoundries (Nasdaq: GFS) announced a manufacturing agreement with TSMC to produce silicon interposers at its Malta, New York facility, supporting TSMC's CoWoS advanced packaging ecosystem for high-performance computing and AI systems.

Under the five-year agreement, GlobalFoundries will provide manufacturing services to TSMC and expand fabrication capacity at its Malta site. The company said it expects to establish what it described as the first U.S.-based source of silicon interposers supporting advanced packaging technologies, including embedded deep trench capacitor components.

Volume production is expected to begin ramping at the Malta facility during the first half of 2028. The agreement includes a framework for future capacity expansion as customer demand grows.

Ed Kaste, senior vice president of CMOS Business at GlobalFoundries, said: "By providing manufacturing service using GF's trusted U.S. manufacturing footprint, we are creating a secure, scalable source of essential advanced-packaging elements that will help customers accelerate innovation and strengthen the semiconductor supply chain."

The information is based on a press release issued by GlobalFoundries.

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