Teradyne launches Titan HP platform with burn-in for AI chips

Teradyne, Inc. (NASDAQ: TER) announced the availability of its Titan HP platform with enhanced burn-in capabilities, targeting high-power AI, automotive, and other high-reliability semiconductor devices.

Unlike traditional burn-in, which holds devices in dedicated ovens at a controlled air temperature before functional testing, the Titan HP platform controls each device's junction temperature individually while running a realistic workload. The system's asynchronous slot architecture allows each slot to load and test independently, so a lengthy stress run on one device does not halt others, and individual sites can be serviced while the system remains operational.

The platform supports both system level test and reliability testing, with each device carrying a full stress-and-test history on a single record. Test programs run on Teradyne's Atlas software platform, which allows engineers to import existing programs or build new ones and port them to other Teradyne system level test systems.

"Our customers are being asked to ship high-power AI silicon at reliability levels that used to belong to automotive," said Jason Zee, vice president and general manager of Teradyne's Integrated Systems Test division. "Moving reliability stress testing onto a system level test platform means optimized reliability, which can lower cost of test, improve time to market and deliver better data on every device shipped."

Teradyne states the Titan HP is currently deployed in production. The company plans to showcase the platform at SEMICON West, October 13–15, 2026, in San Francisco, and at the IEEE International Test Conference, October 11–16, in San Antonio, Texas.

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