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onsemi unveils wafer-based power platform targeting AI and EVs

September 16, 2026 2:30 PM EDT

onsemi (Nasdaq: ON) unveiled its Embedded Power Platform (EPP), a power system architecture that uses a silicon wafer as the device package, integrating multiple dies — including FETs, drivers and controllers — into a single unit, according to a company press release dated Sept. 16, 2026.

The platform combines silicon, silicon carbide (SiC) and gallium nitride (GaN) technologies within a wafer-level architecture. onsemi says EPP can deliver 3–5x higher power density compared with current solutions, depending on the application, by co-optimizing electrical, thermal and mechanical design within a single package.

For electric vehicle traction inverters, onsemi claims EPP can achieve up to 4x higher power density and 15% lower power losses relative to conventional designs. In an early solid-state circuit-breaker design for AI infrastructure, an EPP-based solution was approximately 50% smaller and 20% cooler than existing designs, according to the company.

EPP leverages onsemi's standard 12-inch silicon wafer manufacturing capabilities. The company states development cycles could be compressed to as little as four months using the platform.

Subaru Corporation has been named as an early engagement partner, working with onsemi to evaluate EPP for future electrified vehicle architectures. Subaru will receive engineering samples, simulation models and technical support as part of the collaboration.

"For decades, the semiconductor and the package have been treated as separate technologies. EPP changes that by making the silicon itself part of the system architecture," said Hassane El-Khoury, President and CEO of onsemi.

onsemi said EPP is expected to begin sampling with strategic customers across automotive and AI applications in 2026.



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