GlobalFoundries makes UX chip platform available for edge AI devices

GlobalFoundries (Nasdaq: GFS) announced the availability of process design kits (PDKs) for its UX platform family, two CMOS semiconductor technologies targeting intelligent edge devices, at its annual GF Technology Summit in North America on Sept. 2, 2026.

The UX family includes two nodes: 40nm (40UX) and 22nm (22UX). The 40UX platform targets microcontrollers, wearable devices, IoT and wireless connectivity applications, including Bluetooth Low Energy devices. It is built on GlobalFoundries' 40nm platform, which has shipped more than one million wafers. Volume production for 40UX is planned to begin at the company's Singapore facility by 2027, with additional production planned at its Malta, New York site.

The 22UX platform is aimed at applications requiring higher analog integration, including edge AI, imaging and mixed-signal systems. It incorporates wafer-scale Random Telegraph Signal noise characterization and bonding-ready wafers for 3D integration. The 22UX platform will be manufactured at GlobalFoundries' Dresden, Germany facility, with a roadmap for multi-site production. The company said 22UX was developed using proven modules from its 28nm technology, which has also shipped over one million wafers.

Both platforms are available for customer prototyping through the company's GlobalShuttle multi-project wafer program, with quarterly shuttles scheduled through 2027.

"Our new UX platform family gives customers a scalable path to develop differentiated products for the intelligent edge, backed by proven technology and GF's global manufacturing capabilities," said Ed Kaste, senior vice president of GlobalFoundries' CMOS business.

The roadmap for 40UX includes Automotive Grade 1 qualification and enhanced embedded non-volatile memory options. The 22UX roadmap includes analog compute-in-memory capabilities.

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