Qnity joins imec research program for advanced packaging

Qnity Electronics, Inc. (NYSE: Q) has joined imec's research program as part of an effort to advance its semiconductor packaging capabilities, according to a press release from the company.

Imec is a Belgium-based research and innovation center focused on advanced semiconductor technologies. Through the membership, Qnity gains access to imec's research portfolio, infrastructure, and network of industry and academic partners.

The company said the collaboration is intended to support development in areas including chiplets, high-bandwidth memory, wafer-level packaging, 3D stacking, and heterogeneous integration. Qnity's materials focus spans patterning, planarization, metallization, interconnect technologies, and thermal management.

"As computing moves toward shrink and stack, advanced packaging is becoming one of the most critical frontiers for performance, efficiency and scale," said Randy King, Chief Technology Officer at Qnity. "Our collaboration with imec gives us deeper access to the ecosystem, infrastructure, experts, and partnerships needed to help shape that future, bringing next-generation materials innovation to our customers."

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