Teradyne and MultiLane form joint venture for AI data center testing

Teradyne Inc. (NASDAQ: TER) and MultiLane announced an agreement to form a joint venture called MultiLane Test Products to develop test solutions for high-speed data connections in AI data center equipment.

The transaction is expected to close in the first half of 2026, subject to customary closing conditions. Teradyne will be the majority owner, with MultiLane maintaining minority ownership.

Under the agreement, MultiLane will contribute all assets related to its test and measurement business to the joint venture while retaining its existing interconnect and data center test solution businesses. The joint venture aims to combine Teradyne's global electronics test market reach with MultiLane's high-speed instrumentation expertise.

"Compute architectures are evolving quickly, driven by explosive growth in AI and the need for massive, reliable high‑speed interconnects," said Greg Smith, President and CEO of Teradyne. "With the creation of MultiLane Test Products, we can expand our ability to support Teradyne customers all the way from the wafer level to the data center."

Fadi Daou, Founder and CEO of MultiLane, said the joint venture combines MultiLane's technical leadership with Teradyne's commercial scale and customer reach to deliver comprehensive test solutions across compute infrastructure from silicon to system.

The companies stated the joint venture is expected to expand the served market for Teradyne's Semiconductor Test and Product Test Groups. Teradyne designs and manufactures automated test equipment and advanced robotics systems, while MultiLane specializes in high-speed I/O and data center interconnect test solutions.

Information in this article is based on a press release statement from the companies.

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