6703 and OKIEY Related Headlines

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Jun 10, 2026 12:00PM OKI Selected as Representative Organization for JAXA Space Strategy Fund Project Proposed Jointly with LTS
Jun 8, 2026 12:00PM OKI partners with US-based Lazarus AI for mission-critical applications
Jun 8, 2026 12:00PM OKI Signs Strategic Partnership Agreement with US-Based Lazarus AI
Apr 27, 2026 12:00PM OKI Develops 180-Layer 15 mm-Thick PCB Technologies for Next-Generation AI Semiconductor Testing Equipment
Mar 24, 2026 12:00PM OKI Launches EMS for AI Server Equipment Featuring Proprietary High Heat Dissipation Technology
Feb 3, 2026 12:00PM OKI Introduces ORP-SL105 °C Slim High-Flexibility Robot Cable Rated to 105 °C
Dec 17, 2025 12:00PM OKI Launches GVIF/GMSL-Compatible Machine Vision Cables with FAKRA Connectors for AI Robots and Industrial FA Equipment
Dec 11, 2025 12:00PM OKI Launches Sliding, Small-Diameter K Type CoaXPress 2.0 Cable for Industrial Camera Equipment, realizing 50 Million Cycles of Sliding and Bending Durability with Narrow 3.7 mm Outer Diameter
Dec 9, 2025 09:00PM OKI Conducts Remote Slope Monitoring Demonstration Experiment for Railway Disaster Prevention and Maintenance in Collaboration with Indonesian National Railways under the JICA SDGs Business Supporting
Nov 24, 2025 09:00PM OKI Launches Projection Assembly SystemTM in Southeast Asia
Nov 18, 2025 12:00PM OKI Develops High-Accuracy Simulation Technology for High-Frequency Vias for 1.6 Tbps-class High-Speed Transmission PCBs to Support Next-Generation AI Data Centers
Sep 29, 2025 12:00PM OKI Partners with Lipi Data Systems Ltd to Begin Local Production of ATMs for the Indian Market
Sep 8, 2025 12:00PM OKI Signed Memorandum of Understanding with Turkish State Railways for the Proof of Concept Using Zero Energy IoT Series IoT Disaster Prevention Inspection and Monitoring Technology
Aug 14, 2025 12:00PM OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
Jul 28, 2025 12:00PM OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
Jul 23, 2025 12:00PM OKI Becomes First Japanese Company to Acquire ISO 56001 International Standard for Innovation Management Systems
Jul 7, 2025 12:00PM OKI Launches Small-Lot Custom Long FPCs for the New Space Industry
Jun 20, 2025 12:00PM OKI and NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding

6703 and OKIEY Related Press Releases

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Jun 10, 2026 12:00PM OKI Selected as Representative Organization for JAXA Space Strategy Fund Project Proposed Jointly with LTS
Jun 8, 2026 12:00PM OKI Signs Strategic Partnership Agreement with US-Based Lazarus AI
Apr 27, 2026 12:00PM OKI Develops 180-Layer 15 mm-Thick PCB Technologies for Next-Generation AI Semiconductor Testing Equipment
Mar 24, 2026 12:00PM OKI Launches EMS for AI Server Equipment Featuring Proprietary High Heat Dissipation Technology
Feb 3, 2026 12:00PM OKI Introduces ORP-SL105 °C Slim High-Flexibility Robot Cable Rated to 105 °C
Dec 17, 2025 12:00PM OKI Launches GVIF/GMSL-Compatible Machine Vision Cables with FAKRA Connectors for AI Robots and Industrial FA Equipment
Dec 11, 2025 12:00PM OKI Launches Sliding, Small-Diameter K Type CoaXPress 2.0 Cable for Industrial Camera Equipment, realizing 50 Million Cycles of Sliding and Bending Durability with Narrow 3.7 mm Outer Diameter
Dec 9, 2025 09:00PM OKI Conducts Remote Slope Monitoring Demonstration Experiment for Railway Disaster Prevention and Maintenance in Collaboration with Indonesian National Railways under the JICA SDGs Business Supporting
Nov 24, 2025 09:00PM OKI Launches Projection Assembly SystemTM in Southeast Asia
Nov 18, 2025 12:00PM OKI Develops High-Accuracy Simulation Technology for High-Frequency Vias for 1.6 Tbps-class High-Speed Transmission PCBs to Support Next-Generation AI Data Centers
Sep 29, 2025 12:00PM OKI Partners with Lipi Data Systems Ltd to Begin Local Production of ATMs for the Indian Market
Sep 8, 2025 12:00PM OKI Signed Memorandum of Understanding with Turkish State Railways for the Proof of Concept Using Zero Energy IoT Series IoT Disaster Prevention Inspection and Monitoring Technology
Aug 14, 2025 12:00PM OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
Jul 28, 2025 12:00PM OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
Jul 23, 2025 12:00PM OKI Becomes First Japanese Company to Acquire ISO 56001 International Standard for Innovation Management Systems
Jul 7, 2025 12:00PM OKI Launches Small-Lot Custom Long FPCs for the New Space Industry
Jun 20, 2025 12:00PM OKI and NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding

6703 and OKIEY Related SEC Filings

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