Applied Materials partners with Broadcom on AI chip packaging technology
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Applied Materials Announces Broadcom as EPIC Innovation Partner
May 20, 2026 8:00 AM EDTCompanies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems Partnership will leverage Applieds global network of innovation centers, including new EPIC Center in Silicon Valley
SANTA CLARA, Calif., May 20, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering for the semiconductor industry, today announced that Broadcom Inc. (Nasdaq: AVGO) will join Applieds EPIC platform as an innovation partner to accelerate development of advanced chip packaging technologies critical to next-generation AI... More
