JetCool partners with Broadcom for AI chip cooling solutions

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JetCool Collaborates with Broadcom to Deliver Innovative Liquid Cooling for Next-Generation AI XPUs

March 11, 2026 9:05 AM EDT

AUSTIN, Texas, March 11, 2026 /PRNewswire/ -- JetCool, a Flex (NASDAQ: FLEX) company and a leading provider of end-to-end liquid cooling solutions for high-density compute, today announced it has collaborated with Broadcom to deliver liquid cooling for next-generation AI XPUs, backed by Flex's global mass production capabilities.

As AI training and inference workloads accelerate, silicon power densities are advancing into sustained multi-kilowatt ranges per device. Thermal architecture now directly impacts system performance, long-term reliability, and deployment... More