Adeia expands licensing partnership with UMC for hybrid bonding tech
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Adeia and UMC Expand Long-Term Collaboration in Hybrid Bonding Technologies
March 11, 2026 8:00 AM EDTSAN JOSE, Calif., March 11, 2026 (GLOBE NEWSWIRE) -- Adeia Inc. (Nasdaq: ADEA), the technology company known for developing foundational innovations that enable next-generation solutions for the semiconductor and media industries, today announced that it has expanded and renewed its intellectual property (IP) licensing relationship with United Microelectronics Corporation (UMC), a leading global semiconductor foundry. The new agreement provides UMC with continued access to Adeias semiconductor portfolio, including hybrid bonding technologies, and extends the companies collaboration into future generations of 3D integration and advanced packaging solutions.
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