Applied Materials and SK hynix form R&D partnership for AI memory tech
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Applied Materials and SK hynix Announce Long-Term R&D Partnership to Accelerate AI Memory Innovation at EPIC Center in Silicon Valley
March 10, 2026 4:00 PM EDTJoint R&D programs focused on advancing materials engineering and advanced packaging innovations for next-generation DRAM and high-bandwidth memory (HBM)Opening this year, Applieds EPIC Center is designed to provide chipmakers and ecosystem partners with earlier access to Applieds R&D portfolio, faster cycles of learning and accelerated transfer of next-generation technologies into high-volume manufacturing
SANTA CLARA, Calif., March 10, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced a long-term collaboration agreement with SK hynix Inc. to accelerate the development and deployment of next-generation DRAM and high-bandwidth memory (HBM) essential for AI and... More
