Applied Materials (AMAT) announces new chip tool to streamline lithography process
FREE Breaking News Alerts from StreetInsider.com!
StreetInsider.com Top Tickers, 10/3/2026
- Equities close higher as softer jobs data quiets rate-hike expectations
- U.S. economy adds fewer jobs than expected as unemployment rate ticks higher
- Nvidia returns as Morgan Stanley’s Top Pick on attractive valuation
- Citi says rate volatility without Fed repricing is concerning
- U.S. credit-reporting stocks fall as FHFA weighs two-bureau mortgage rule
- Cantor Fitzgerald on Rivian (RIVN): 'pre-announced that it delivered 19,248 vehicles in 3Q26, above our estimate'
- Equities close higher as softer jobs data quiets rate-hike expectations
- DISH DBS emerges from bankruptcy, cuts debt by $4.35 billion
- Tanker struck by projectile in Strait of Hormuz
- AppLovin shares fall after court denies request against Unity
Applied Materials’ New eBeam Metrology System Paves the Way to High-NA EUV Lithography
February 28, 2023 7:36 AM ESTNew VeritySEM® 10 system delivers industry-leading resolution and imaging speed to help chipmakers accelerate process development and maximize yield in high-volume manufacturing
SANTA CLARA, Calif., Feb. 28, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced a new eBeam metrology system specifically designed to precisely measure the critical dimensions of semiconductor device features patterned with EUV and emerging High-NA EUV lithography.
Chipmakers use CD-SEMs (critical dimension scanning electron microscopes) to take sub-nanometer measurements of patterns once a lithography scanner transfers them from a mask to a photoresist. These measurements continuously calibrate... More
Applied Materials’ New eBeam Metrology System Paves the Way to High-NA EUV Lithography
February 28, 2023 7:35 AM ESTNew VeritySEM® 10 system delivers industry-leading resolution and imaging speed to help chipmakers accelerate process development and maximize yield in high-volume manufacturing
SANTA CLARA, Calif., Feb. 28, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced a new eBeam metrology system specifically designed to precisely measure the critical dimensions of semiconductor device features patterned with EUV and emerging High-NA EUV lithography.
Chipmakers use CD-SEMs (critical dimension scanning electron microscopes) to take sub-nanometer measurements of patterns once a lithography scanner transfers them from a mask to a photoresist. These measurements continuously calibrate lithography... More
Applied Materials’ Innovative Pattern-Shaping Technology Reduces the Cost, Complexity and Environmental Impact of Advanced Chip Manufacturing
February 28, 2023 7:31 AM ESTThe new Centura® Sculpta® patterning system provides a simpler, faster and more cost-effective alternative to EUV double patterning
SANTA CLARA, Calif., Feb. 28, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today unveiled a breakthrough in patterning technology that allows chipmakers to create high-performance transistors and interconnect wiring with fewer EUV lithography steps, thereby lowering the cost, complexity and environmental impact of advanced chipmaking.
Customers increasingly use EUV double patterning to print chip features smaller than the resolution limits of EUV to optimize... More
