Applied Materials (AMAT) announces new chip tool to streamline lithography process
FREE Breaking News Alerts from StreetInsider.com!
StreetInsider.com Top Tickers, 8/17/2026
- S&P 500 ends lower as investors weigh data, Middle East tensions
- BofA's Hartnett explains why Wall Street is trading with 'no fear'
- Oil rises after US threatens indefinite blockade of Iran; set for weekly gains
- Are KOSPI and SOX in a bubble? Citi answers
- Could Intel return to the red-hot memory market after $20B raise and recent hire?
- S&P 500 ends lower as investors weigh data, Middle East tensions
- SanDisk upgraded at JPMorgan after investor day; shares climb
- BofA's Hartnett explains why Wall Street is trading with 'no fear'
- BOJ eyeing September rate hike, faster pace of tightening, sources say
- Micron: New Street upgrades to buy, says memory is no longer a cyclical story
Applied Materials’ New eBeam Metrology System Paves the Way to High-NA EUV Lithography
February 28, 2023 7:36 AM ESTNew VeritySEM® 10 system delivers industry-leading resolution and imaging speed to help chipmakers accelerate process development and maximize yield in high-volume manufacturing
SANTA CLARA, Calif., Feb. 28, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced a new eBeam metrology system specifically designed to precisely measure the critical dimensions of semiconductor device features patterned with EUV and emerging High-NA EUV lithography.
Chipmakers use CD-SEMs (critical dimension scanning electron microscopes) to take sub-nanometer measurements of patterns once a lithography scanner transfers them from a mask to a photoresist. These measurements continuously calibrate... More
Applied Materials’ New eBeam Metrology System Paves the Way to High-NA EUV Lithography
February 28, 2023 7:35 AM ESTNew VeritySEM® 10 system delivers industry-leading resolution and imaging speed to help chipmakers accelerate process development and maximize yield in high-volume manufacturing
SANTA CLARA, Calif., Feb. 28, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced a new eBeam metrology system specifically designed to precisely measure the critical dimensions of semiconductor device features patterned with EUV and emerging High-NA EUV lithography.
Chipmakers use CD-SEMs (critical dimension scanning electron microscopes) to take sub-nanometer measurements of patterns once a lithography scanner transfers them from a mask to a photoresist. These measurements continuously calibrate lithography... More
Applied Materials’ Innovative Pattern-Shaping Technology Reduces the Cost, Complexity and Environmental Impact of Advanced Chip Manufacturing
February 28, 2023 7:31 AM ESTThe new Centura® Sculpta® patterning system provides a simpler, faster and more cost-effective alternative to EUV double patterning
SANTA CLARA, Calif., Feb. 28, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today unveiled a breakthrough in patterning technology that allows chipmakers to create high-performance transistors and interconnect wiring with fewer EUV lithography steps, thereby lowering the cost, complexity and environmental impact of advanced chipmaking.
Customers increasingly use EUV double patterning to print chip features smaller than the resolution limits of EUV to optimize... More
