MaxLinear launches two new eFuse chips for AI data center power

MaxLinear, Inc. (NASDAQ: MXL) announced two new 16V high-current electronic fuse (eFuse) products, the MxL745950 and MxL745951P, targeting power protection and telemetry applications in AI infrastructure, according to a company press release.

The MxL745950 is a 50A eFuse with 1mΩ on-resistance in a 5mm × 5mm LGA-32 package. It includes analog current sensing, temperature monitoring, fault indication, and programmable soft-start with parallel-operation support. The MxL745951P is a 60A stackable eFuse with 0.79mΩ on-resistance in a 5mm × 4.5mm VQFN-26L package. It adds a PMBus/I²C interface, high-precision telemetry with ±1% current monitoring accuracy, non-volatile fault recording, and active current balancing.

Both devices are designed for use in AI servers, accelerator trays, data center switches, fan trays, power shelves, and rack-scale platforms. The products are currently sampling, with volume production expected in Q4 2026.

"As AI infrastructure scales, the opportunity is expanding beyond compute silicon into the control, power, and telemetry technologies required to operate dense racks reliably," said Amit D. Bavisi, Ph.D., Senior Vice President and General Manager, Analog Mixed-Signal Business Unit at MaxLinear.

MaxLinear plans to showcase both products at the OCP APAC 2026 Summit, scheduled for August 11–12, 2026, at TaiNEX2 in Taipei City, Taiwan, at booth PL33.

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