BTQ Technologies and ICTK finish design of quantum security chip

BTQ Technologies Corp. (Nasdaq: BTQ) announced it has completed the design of a security chip that combines its Quantum Compute-in-Memory (QCIM) technology with ICTK Co., Ltd.'s (KOSDAQ: 456010) VIA PUF™ technology. Production preparation is now underway, according to a company press release.

The chip is intended to support device authentication, cryptographic acceleration, and hardware-rooted device identity for IoT, AI devices, industrial systems, and connected infrastructure. BTQ's QCIM architecture is designed to execute cryptographic operations inside the memory subsystem, targeting reduced latency and power consumption while supporting both classical and post-quantum cryptographic functions.

Physically Unclonable Function (PUF) technology generates unique hardware-derived identities based on microscopic manufacturing variations. ICTK's VIA PUF™ technology derives each chip's identity from randomness across hundreds of thousands of logic vias.

The two companies first signed a memorandum of understanding in May 2025 to explore quantum-secure hardware solutions. In October 2025, they expanded that relationship through a $15 million development and joint investment agreement to co-develop QCIM.

"Completing the design of our next-generation QCIM quantum-security chip is an important step toward bringing BTQ's security IP into deployable semiconductor infrastructure for the quantum era," said Olivier Roussy Newton, CEO and Chairman of BTQ.

BTQ said it expects to ship test chips to key customers and strategic partners by year-end for performance and functional validation, as part of its path toward mass production readiness.

ICTK has existing partnerships with telecommunications and financial services companies, including mobile network operator LG U+.

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