Nova wins foundry contract for WMC platform in advanced packaging
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Nova (NASDAQ: NVMI) announced that a global foundry customer has selected its Nova WMC™ platform as tool-of-record for multiple layers' measurement in advanced packaging processes, following a competitive evaluation.
The selection is expected to support multiple advanced packaging production flows. Nova said the win could lead to additional deployment opportunities as the customer expands production capacity.
Nova also noted broader adoption of the WMC™ platform across several memory and foundry customers, which the company described as an accelerating trend.
"Following a successful introduction, Nova WMC™ is now entering a rapid growth phase," said Gaby Waisman, President and CEO of Nova. "Customer adoption across advanced packaging and HBM applications underscores the platform's value and positions us to scale as demand accelerates."
According to the company's press release, the WMC™ platform features a modular design and customizable architecture intended to address challenges including high warpage, non-symmetric shapes, and varied surface conditions within a single tool.
Nova is headquartered in Rehovot, Israel, and provides metrology and process control solutions for semiconductor manufacturing. Its shares are traded on the Nasdaq and the Tel Aviv Stock Exchange under the ticker NVMI.
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