Qualcomm and Hugging Face expand AI partnership across devices

Qualcomm Technologies, Inc. (NASDAQ: QCOM) announced an expansion of its strategic relationship with Hugging Face, aimed at connecting Qualcomm's device and data center platforms with Hugging Face's AI model ecosystem and developer tools.

The collaboration centers on three areas: integrating Hugging Face's storage and inference services with Qualcomm's Dragonfly data center solutions, accelerating AI model deployment across edge devices and data center hardware, and enabling agentic AI orchestration across device and cloud environments.

As part of the arrangement, Hugging Face's internal and developer workloads are planned to move onto Qualcomm Dragonfly data center infrastructure. Hugging Face's ecosystem of over 3 million open models is also expected to be deployable on Qualcomm platforms through an automated agent that handles setup, optimization, and deployment.

Hugging Face will offer access to its PRO subscription to customers using devices or cloud systems running on Qualcomm platforms. The companies also plan to develop a Hugging Face Agent for hybrid orchestration of AI workloads between edge devices and data center solutions.

"By combining Qualcomm's leadership in high-performance, low-power computing with Hugging Face's vibrant developer ecosystem, we are enabling a new generation of AI applications that seamlessly span device and cloud," said Cristiano Amon, President and CEO of Qualcomm Incorporated.

Clément Delangue, Co-founder and CEO of Hugging Face, said the collaboration would allow the platform's 16 million developers to run open models across the compute continuum, from handheld devices to data center racks.

The announcement was made in New York, according to a press release from Qualcomm Technologies.

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