Qnity launches advanced packaging hub for AI and chip markets

Qnity Electronics, Inc. (NYSE: Q) announced the launch of an Advanced Packaging Innovation Hub, an online platform showcasing the company's materials and technology solutions for advanced semiconductor packaging.

The platform is aimed at customers developing systems for artificial intelligence, high-performance computing, cloud, networking, and edge computing applications.

According to a press release, the hub highlights Qnity's offerings across the advanced packaging stack, including solutions for High Bandwidth Memory, interposers, bonding, assembly, and IC substrates. The company says its products address manufacturing needs such as high-density interconnects, through-silicon vias, fine-line redistribution layers, hybrid bonding, and multi-die integration.

"As AI reshapes computing, the hardest engineering problems are moving into the connections between chips, layer to layer — where performance, power, density, and reliability are decided," said Chuck Xu, President of Interconnect Solutions at Qnity. "That's where Qnity shines. We bring our semiconductor and interconnect strengths together so customers can master advanced packaging from design through system integration, end-to-end."

The company is based in Wilmington, Delaware.

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