Intel appoints Seok-Hee Lee as EVP to lead advanced packaging

Intel Corporation (Nasdaq: INTC) has appointed Seok-Hee Lee as executive vice president of Intel Foundry, where he will oversee advanced packaging, system integration, back-end technology development, and back-end manufacturing. Lee will report directly to CEO Lip-Bu Tan.

Lee joins Intel from SK On, where he served as president and CEO. He previously held the same title at SK hynix and has held engineering leadership roles at Intel earlier in his career.

"Seok-Hee brings deep expertise in leading complex, high-scale technology and manufacturing organizations, along with a strong track record of operational execution," said Tan. He added that Lee's role will focus on coupling logic, memory, networking, and other components for Intel Foundry customers, with plans to ramp advanced packaging technologies, including EMIB-T and HBI, to high volume.

As part of the restructuring, Intel is establishing advanced packaging as a separate focused business unit. Naga Chandrasekaran, also an executive vice president at Intel Foundry, will continue reporting to Tan and retain responsibility for front-end technology development and manufacturing, including the ramp of Intel 18A and Intel 14A technologies, as well as design enablement and customer-facing functions.

Intel also announced that executive vice president Navid Shahriari will retire after 37 years at the company.

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