Interlink Electronics signs non-binding letter for potential acquisition

Interlink Electronics Inc. (NASDAQ: LINK) entered into a non-binding letter of intent for a potential strategic acquisition, the company announced May 11. The acquisition target is a manufacturing solutions provider serving semiconductor, defense, laser and photonics, commercial high-tech, and aerospace sectors.

The target company generated more than $33 million in revenue and approximately $4 million in EBITDA for 2025, according to information provided to Interlink.

If completed, the transaction would be financed through a combination of debt and equity securities issued to sellers. The equity would be valued based on prevailing market price at closing, subject to a minimum price of $5.00 per share and maximum price of $10.00 per share.

"We are pleased to have entered into this non-binding LOI as we continue to evaluate opportunities that may support our long-term strategic growth objectives," said Steven N. Bronson, CEO of Interlink.

The letter of intent remains non-binding and any transaction is subject to due diligence completion, negotiation of definitive agreements, financing availability, required approvals, and customary closing conditions. The parties may terminate discussions at any time, and there is no assurance that definitive agreements will be reached or that any transaction will be completed.

Interlink Electronics provides sensor technology and printed electronic solutions to markets including medical, industrial, automotive, wearables, and IoT from facilities in California, China, and Scotland.

You May Also Be Interested In

• FTI Consulting names Dean Felton as Senior Managing Director in Australia
• Buffalo Potash closes C$14.85M private placement final tranche
• Intrusion acquires VigilAigent, adding $3.5M in recurring revenue