JetCool partners with Broadcom for AI chip cooling solutions

JetCool, a subsidiary of Flex (NASDAQ: FLEX), announced a collaboration with Broadcom to develop liquid cooling solutions for artificial intelligence processors. The partnership addresses thermal management challenges as AI chip power densities reach multi-kilowatt levels per device.

The collaboration produced a single-phase direct-to-chip cooling solution designed to work with Broadcom's reference architecture. The system supports sustained multi-kilowatt ASIC operation at heat flux levels of 4 W/mm² per device, according to the companies.

"Supporting multi-kilowatt ASIC platforms requires a tight coordination across silicon architecture, advanced packaging, power delivery, and thermal engineering," said Ken Kutzler, VP of AI Systems Development for Broadcom's ASIC Products Division. The partnership provides "a clear path from advanced ASIC innovation to high-volume AI XPU deployment."

Bernie Malouin, VP of Liquid Cooling at Flex, noted that cooling has become "a primary design constraint for next-generation AI silicon." The solution combines JetCool's cold plate technology with Flex's manufacturing capabilities.

The thermal solution aims to enable high-volume manufacturing through Flex's global production scale. JetCool provides cooling infrastructure including cold plates, manifolds, and coolant distribution units backed by Flex's manufacturing operations across 30 countries.

The partnership targets AI systems requiring sustained multi-kilowatt performance for high-density ASIC platforms. Broadcom maintains partnerships with multiple cooling solution providers as part of its broader ecosystem approach to thermal management for AI infrastructure.

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