Adeia expands licensing partnership with UMC for hybrid bonding tech

Adeia Inc. (NASDAQ: ADEA) announced an expanded intellectual property licensing agreement with United Microelectronics Corporation, extending the semiconductor foundry's access to Adeia's hybrid bonding and advanced packaging technologies.

The renewed agreement provides UMC with continued access to Adeia's semiconductor portfolio and extends collaboration into future generations of 3D integration and advanced packaging solutions. UMC has previously used the partnership for 3D integration of RFSOI wafers for RF front-end modules.

"The industry is seeing growing demand for chiplet architectures, driven by AI but also across diverse applications from networking to automotive," said Steven Hsu, Vice President of Technology Development at UMC. "UMC is pleased to deepen this collaboration as we expand our advanced packaging services."

Adeia's semiconductor IP portfolio includes hybrid bonding, advanced packaging, and semiconductor processing technologies that enable tighter interconnect pitch, improved power efficiency, greater bandwidth and increased reliability for logic, memory, AI accelerators, and high-performance computing devices.

"Our innovations in hybrid bonding and advanced interconnect technologies are helping shape the future of semiconductors," said Dr. Mark Kokes, chief revenue officer of Adeia. "This agreement reflects the strength of our IP portfolio and our commitment to supporting UMC."

The information is based on a company press release statement. Adeia has developed semiconductor innovations for over 30 years, with IP licensed across the global semiconductor ecosystem.

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