SJSemi and Qualcomm Jointly Announce Qualification of 10nm Ultra-high Density Wafer Bumping Technology Sep 15, 2017 12:54AM
Cista Design Inc. Selects Kilopass OTP NVM for Next Generation CMOS Image Sensor on SMIC Independently Developed 130nm Back Side Illumination Technology Platform Jul 6, 2017 09:00AM
SJSemi and Qualcomm Jointly Announce Mass Production of 14nm Wafer Bumping Technology Jul 28, 2016 12:00AM
SMIC, CICIIF and Qualcomm Intend to Invest into SJsemi Sep 16, 2015 06:29AM
SMIC, Huawei, imec, and Qualcomm in Joint Investment on SMIC's New Research and Development Company Jun 23, 2015 09:11AM


Oct 27, 2014 05:30PM Market Wrap: Valeant Lifts Allergan Bid; Twitter's Ho-Hum Q3 Report; Tesla Slumps on Sales Speculation