Taiwan's MediaTek says it supports both TSMC and Intel's advanced packaging technologies

By Wen-Yee Lee

TAIPEI, May ‌29 (Reuters) - Taiwan ​chip ​designer MediaTek said on Friday it supports both TSMC's and Intel's advanced packaging technologies, allowing customers to ‌choose between the two approaches.

"We're one of the few ⁠custom silicon providers that support both (TSMC's) CoWoS and (Intel's) EMIB. We let our ‌customers choose," MediaTek Senior ‌Vice President Vince Hu told reporters in Taipei.

CoWoS, or Chip-on-Wafer-on-Substrate, is TSMC's advanced packaging technology widely used for artificial ​intelligence chips, including those designed by Nvidia. EMIB, or Embedded Multi-die Interconnect Bridge, is Intel's competing advanced packaging technology.

Intel’s ⁠EMIB advanced packaging technology is being considered for custom AI chips MediaTek is designing ​for Alphabet’s Google, according to two people familiar with the matter.

MediaTek has not publicly identified Google as ​a customer for its custom ‌chip business and did not comment on whether it may use EMIB technology for chips for ⁠Google.

MediaTek, which has been expanding its custom AI chip business beyond its traditional mobile chip operations, reiterated that it had doubled its ⁠forecast for 2026 data center sector revenue to $2 billion.

The company estimates the ​total addressable market (TAM) for custom AI Application-Specific Integrated Circuits could reach $70 billion to $80 billion in 2027 and it targets a 10% to 15% share ‌of that market.

MediaTek also said it has multiple test chips on TSMC's A14 process, the ‌chipmaker's next-generation manufacturing technology expected to enter volume production in 2028.

The ⁠company also said it ‌plans to use TSMC's ​Arizona fabs, including for chips manufactured on 4-nanometre and 3-nanometre technologies.

(Reporting by Wen-Yee Lee; Editing by Susan ‌Fenton)

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