Samsung Electronics says it has shipped HBM4 chips to customers
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Samsung Electronics HBM4, a sixth-generation high-bandwidth memory solution for AI and HPC applications, on display during the 2025 Korea Tech Festival in Seoul, South Korea, December 4, 2025. REUTERS/Kim Hong-Ji
SEOUL, Feb 12 (Reuters) - Samsung Electronics said on Thursday that it has begun shipping its latest high-bandwidth memory chips, known as HBM4, to customers as the South Korean chipmaker seeks to catch up with rivals in the race to supply the semiconductor crucial for Nvidia's AI chipsets.
Samsung Electronics said it is first company to mass-produce and ship the HBM4 chips.
(Reporting by Hyunjoo JinEditing by Ed Davies)
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