Visitech Launches 1-micron Maskless Photohead for Advanced Packaging

Visitech announces the launch of its next generation 1µm L/S photohead, the LLS1000, enabling tool makers freedom to develop custom solutions for direct write/imaging to address the needs of large substrate packaging.

DRAMMEN, Norway, Oct. 8, 2026 /PRNewswire-PRWeb/ -- Visitech announces the launch of its next generation 1 µm L/S photohead - the LLS1000. The LLS1000 enables tool makers freedom to develop custom solutions for direct write/imaging to address the needs of large substrate packaging. Visitech has developed a unique optical architecture that enables 1 µm CD resolution targeting more than 50 panels per hour for 515x510 panels and more than 100 wafers per hour.

The LLS1000 employs several advanced processing technologies that provide toolmakers with real-time positional and panel warping compensation and stitch-free exposures. These compensation techniques are ideal for fan-out wafer-level packaging (FOWLP), fan-out panel-level packaging (FOPLP), and co-packaged optics (CPO). Together, they give machine builders and tool makers greater process freedom for dies exceeding the reticle field, while supporting high yield, high throughput, and robust operation on the production floor.

The LLS1000 is designed with the flexibility of direct imaging - empowering true high-throughput like a stepper and expanding Visitech's growing range of photoheads aimed at production environments. This addresses industry's core challenge of affordable production cost and flexibility.

"Semiconductor manufacturers and tool makers are under growing pressure to pack more functionality into smaller packages, while keeping production costs under control", said Oyvind Tafjord, CEO of Visitech. "We're working with select partners to optimize our direct imaging lithography tools to meet that pressure without sacrificing flexibility, whether the target is wafer or panel-based advanced packaging format."

Visitech is previewing the LLS1000 and its range of photohead solutions at its booth #3116 at Semicon West 2026, October 13th-15th.

Visitech AS develops and manufactures high-performance photohead solutions for maskless direct-imaging lithography in PCB production and advanced semiconductor packaging. The company also offers purpose-built solutions for additive manufacturing, metrology, and advanced display applications. Engineered in-house and proven in thousands of production systems worldwide, Visitech's subsystems integrate seamlessly into customers' equipment platforms. Headquartered in Norway, Visitech supports its global customer base through operations in the United States, China, and Japan. For more information, visit www.visitech.com

Media Contact

Laura Moiseja, Visitech AS, 47 97267890, [email protected], www.visitech.com

Amanda Kunzman, Visitech America, 1 8775284747, [email protected]

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SOURCE Visitech AS