Semtech Demonstrates AI Data Center Connectivity Expertise at DesignCon 2026

System architects to present power-efficient interconnect solutions for hyperscale AI infrastructure

CAMARILLO, Calif.--(BUSINESS WIRE)-- Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, will showcase artificial intelligence (AI) data center connectivity expertise at DesignCon 2026 (Feb. 24-26, Santa Clara Convention Center) through technical presentations and private demonstrations addressing critical power efficiency and bandwidth challenges in hyperscale deployments.

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Semtech Demonstrates AI Data Center Connectivity Expertise at DesignCon 2026

According to Dell’Oro Group, data center interconnect accounted for the most bandwidth growth over the past year, driven by large deployments from cloud providers. This trend is expected to continue beyond 2026 as hyperscalers expand AI data centers across multiple buildings to tap into different electricity grids for power-hungry GPU compute clusters.

As data center interconnect drives unprecedented bandwidth growth, Semtech’s DesignCon presence reinforces its position as a trusted partner for infrastructure architects navigating the transition to 400G, 800G, and 1.6T interconnects.

“Our customers are navigating unprecedented challenges—scaling GPU clusters while managing power constraints and signal integrity at multi-terabit speeds,” said Amit Thakar, vice president of signal integrity product marketing at Semtech. “DesignCon provides the ideal platform to share technical insights on both copper and optical approaches that help infrastructure architects optimize for performance, efficiency, and scalability.”

Semtech Technical Presentations

“400G Channels for AI Applications: Passive & Active Copper Cable Assemblies to Enable Scale Up/Scale Out”
Wednesday, Feb. 25, 11:15 AM PT, Ballroom E
Joint presentation with TE Connectivity examining copper solutions for high-density GPU clusters. Semtech Presenters: Edward Frlan, Senior System Architect; Sameh Elnaggar, Electrical Engineer.

“200G Per Lane Linear Pluggable Optical Channels for Power-Efficient AI Interconnects”
Thursday, Feb. 26, 2:00 PM PT, Ballroom B
Semtech Presenters: Mark Kimber, Sr. Director of Product Definition, and Edward Frlan present Semtech’s approach to power-efficient optical interconnects.

Visit Semtech at DesignCon 2026

Semtech will host private demonstrations throughout the conference in a dedicated meeting room, offering hands-on evaluation of connectivity solutions for AI data center architectures. Schedule a meeting or learn more at www.semtech.com.

About Semtech

Semtech Corporation (Nasdaq: SMTC) is a leading provider of high-performance semiconductor, IoT systems and cloud connectivity service solutions dedicated to delivering high-quality technology solutions that enable a smarter, more connected and sustainable planet. Our global teams are committed to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. To learn more about Semtech technology, visit us at Semtech.com or follow us on LinkedIn or X.

Semtech and the Semtech logo are registered trademarks or service marks of Semtech Corporation or its subsidiaries. All other trademarks, service marks and trade names mentioned in this press release are the property of their respective owners.

SMTC-P

View source version on businesswire.com: https://www.businesswire.com/news/home/20260218481565/en/

Michelle Lozada, [email protected]

Source: Semtech Corporation

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