Rambus to Present at Upcoming Investor Conferences

SAN JOSE, Calif.--(BUSINESS WIRE)-- Rambus Inc. (Nasdaq: RMBS), a provider of industry-leading chips and IP making data faster and safer, today announced that its executives will present at three upcoming investor events: the Baird 2025 Global Consumer, Technology & Services Conference; the BofA Securities 2025 Global Technology Conference; and the Rosenblatt 5th Annual Technology Virtual Summit.

Baird’s 2025 Global Consumer, Technology & Services Conference

Desmond Lynch, chief financial officer, and Matt Jones, vice president of strategic marketing, will present at the Baird 2025 Global Consumer, Technology & Services Conference in New York City, NY on Tuesday, June 3, 2025, at 9:40 a.m. ET. The presentation will be available live through a webcast that can be accessed on the Rambus Investor Relations website at investor.rambus.com. A replay of the presentation will also be available on the website following the event.

BofA Securities 2025 Global Technology Conference

Luc Seraphin, chief executive officer, and Desmond Lynch, chief financial officer, will present at the BofA Securities 2025 Global Technology Conference in San Francisco, CA on Thursday, June 5, 2025, at 8:40 a.m. PT. The presentation will be available live through a webcast that can be accessed on the Rambus Investor Relations website at investor.rambus.com. A replay of the presentation will also be available on the website following the event.

Rosenblatt 5th Annual Technology Virtual Summit

Steve Woo, fellow and distinguished inventor, will present at the Rosenblatt 5th Annual Technology Virtual Summit on Tuesday, June 10, 2025, at 11:00 a.m. PT. The presentation will be available live through a webcast that can be accessed on the Rambus Investor Relations website at investor.rambus.com. A replay of the presentation will also be available on the website following the event.

About Rambus Inc.

Rambus is a global semiconductor company dedicated to enabling the future of the data center and artificial intelligence (“AI”) by delivering innovative memory and security solutions that address the evolving needs of the industry. As a pioneer with 35 years of advanced semiconductor design experience, Rambus is at the forefront of enabling the next era of AI-driven computing, addressing the critical challenges of accelerating and securing data movement in the data center, edge, and client markets. Rambus is a leader in high-performance memory subsystems, offering a balanced and diverse portfolio of products encompassing chips and silicon intellectual property (IP). Focusing primarily on the data center, our innovative solutions maximize performance and security in computationally intensive systems. For more information, visit rambus.com.

View source version on businesswire.com: https://www.businesswire.com/news/home/20250515109115/en/

Nicole Noutsios
Rambus Investor Relations
(510) 315-1003
[email protected]

Source: Rambus Inc.

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