SEMIFIVE Submits Securities Registration for KOSDAQ Listing
-
Secures Only 'One-Stop AI ASIC Solution' in
Korea and Big-Die Design Capability - 2025 Q3 Cumulative Revenue Expected to Surpass
KRW 90 Billion ; Large AI Chip Mass Production Begins, Growth to Accelerate from Q4 - Wins Successive AI Chip Design Projects for Global Customers, Expanding into the
U.S. ,China , andJapan
Through this IPO, SEMIFIVE plans to offer a total of 5.4 million shares. The expected offering price ranges from
AI Inference and HPC-Focused SoC Platform: Custom Semiconductor Design from Data Centers to Edge Devices
Founded in 2019, SEMIFIVE is a SoC platform company specializing in AI inference and high-performance computing (HPC) chip design. The company collaborates with leading domestic AI fabless companies such as Rebellion, FuriosaAI, and HyperAccel to develop data center chips, while expanding its design capabilities to edge computing, CXL, autonomous driving, and other applications. Additionally, SEMIFIVE partners with major OEMs to deliver custom solutions for on-device AI, such as vision AI, establishing a diversified product portfolio.
Proving Competitiveness Through 'One-Stop AI ASIC Solution' and Big-Die Design Capability
SEMIFIVE's distinctive strengths lie in:
- Its 'one-stop AI ASIC solution' that covers the entire process from specification definition to design, development, and mass production, and
- Its capability to design large chips (big dies) using cutting-edge processes.
The one-stop AI ASIC solution covers the entire chip design process, facilitating faster and more efficient design to meet customers' needs for speed-to-market and market leadership. SEMIFIVE is the only domestic company capable of executing big-die designs using an end-to-end approach within the Samsung Foundry DSP ecosystem. The company has successfully taped out over 10 big-die projects and has established itself as a key partner in the AI and HPC sectors.
A die is an individual semiconductor chip cut from a wafer. Larger dies can integrate more circuits and functions, making them suitable for high-performance designs such as AI chips. However, due to their design complexity, only a few companies can manage the entire process. Just as Broadcom collaborates with TSMC and secures major contracts with big tech to lead the global custom AI chip market, SEMIFIVE plays a central role in the Samsung Foundry DSP ecosystem, actively collaborating with domestic and global customers.
Another strength of SEMIFIVE is its subsidiary, Analog Bits, which internalizes low-power mixed-signal IP technology within its proprietary design platform. Based in
2025 Q3 Cumulative Revenue Expected to Surpass
SEMIFIVE's competitiveness has already been demonstrated through its tangible results. The company's consolidated order intake increased from
SEMIFIVE's AI ASIC business model generates revenue primarily after development projects are completed and transition into mass production. By consistently repeating the cycle of new chip development and mass production throughout the product lifecycle, the company has established a stable and sustainable foundation for growth.
Large-scale projects currently being developed with Samsung Foundry's 2 nm, 4 nm, 5 nm, 8 nm, and 14 nm processes are set to enter mass production sequentially this year. These projects include on-device AI chips for domestic conglomerates with secure captive markets and promising AI accelerator projects, expected to boost revenue growth from 2026.
Expanding Rapidly Worldwide, including in the
Building on its domestic achievements, SEMIFIVE has secured successive AI chip design projects for global customers in the
Leading Advanced 4nm Chiplet Technology Through Collaboration with Arm and Samsung Foundry
SEMIFIVE is intensifying its R&D investments to improve the scalability of its existing SoC platform and strengthen its competitiveness in next-generation AI chip design. As an official Arm Total Design (ATD) partner of the global semiconductor IP leader Arm, SEMIFIVE is developing the 'Premier' CPU chiplet platform based on Arm architecture using Samsung Foundry's 4nm process (SF4X). Chiplets integrate function-specific chips, such as computing and memory, onto a single substrate, gaining attention for their role in high-performance and low-power semiconductor design fields.
Use of IPO Proceeds
The proceeds obtained from IPO will be allocated to:
-
Enhancing engineering expertise in
Southeast Asia to facilitate project implementation, - Acquiring next-generation IP companies to internalize advanced AI semiconductor technologies, and
- Establishing a solid operational base for mass production, ensuring sustainable growth in the medium to long term.
[SEMIFIVE IPO Summary]
- Shares to be offered: 5,400,000
- Price per share:
KRW 21,000 – 24,000 - Estimated total proceeds:
KRW 113.4 billion – 129.6 billion - Total shares post-IPO: 33,668,800
- Estimated market capitalization:
KRW 708 billion – 809.2 billion
Media Contact
About SEMIFIVE
SEMIFIVE is the pioneer of platform based SoC design, working with customers to implement innovative ideas into custom silicon in the most efficient way. Our SoC platforms offer a powerful springboard for new chip designs and leverage configurable domain-specific architectures and pre-validated key IP pools. We offer comprehensive spec-to-system capabilities with end-to-end solutions so that custom SoCs can be realized faster, with reduced cost and risks for key applications such as data center or AI-enabled IoT. With a strong partnership with Samsung Foundry as a leading SAFETM DSP partner, as well as the larger ecosystem, SEMIFIVE provides a one-stop shop solution for any SoC design needs. For more information, please visit www.semifive.com
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SOURCE SEMIFIVE
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