STMicroelectronics launches compact 3D LiDAR module for edge AI

STMicroelectronics (NYSE: STM) announced the launch of the VL53L9, a direct Time-of-Flight (dToF) 3D LiDAR all-in-one module, on June 22, 2026. The company said mass production is scheduled to begin in early July 2026, with samples and volume shipments available to customers globally.

According to the company, the VL53L9 is the first dToF 3D LiDAR all-in-one module in STMicroelectronics' portfolio. The module offers 2,268 resolution zones (54x42) with a 54°x42° field of view, a sensing range from less than 5 centimeters to 9 meters, up to 1% ranging accuracy, and a frame rate of up to 100 frames per second.

The module measures 12.8 mm x 6.1 mm x 4.6 mm and integrates on-chip dToF processing and a dedicated power management IC. STMicroelectronics said the device is calibration-free and supports MIPI or I3C data interfaces with dual power supply operation at 1.2 V and 3.3 V. It is certified as Class 1 laser safe.

STMicroelectronics stated the VL53L9 is designed for use in robotics, industrial automation, smart buildings, AR/VR, and healthcare applications. Specific use cases cited include obstacle avoidance, volume measurement, people counting, gesture recognition, and fall detection.

"VL53L9 demonstrates how far Time-of-Flight sensing has evolved, combining high-resolution depth data, up to 100 frames per second, and a fully integrated architecture in a single compact module," said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics.

The module uses dual-scan flood illumination and STMicroelectronics' stacked BSI SPAD sensor technology combined with metasurface optical elements. The company said these features reduce motion artifacts and eliminate dead zones compared to traditional dot scanning approaches.

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