Coherent launches bondable diamond thermal management solutions

Coherent Corp. (NYSE: COHR) announced the launch of bondable diamond solutions for thermal management applications. The technology features a specialized surface finish that enables direct bonding to semiconductor die for electronic and opto-electronic applications.

The bondable diamond products are designed to eliminate or reduce thermal interface resistance, which the company states can improve device cooling performance. The solutions feature controlled surface roughness, flatness, coatings, and preparation that enable direct bonding to semiconductor materials including silicon, silicon carbide, gallium nitride, aluminum gallium nitride, gallium arsenide, and indium phosphide.

According to the company, conventional thermal spreaders rely on Thermal Interface Materials whose thermal resistance limits performance. Coherent's direct bonding technology through fusion, hybrid, or metallic bonding can reduce interface thermal resistance by up to 99% and can be implemented on die sizes up to 100mm square.

"As one of the world's largest producers of technical diamond since 2010, and a pioneer in diamond fabrication and coating, Coherent is uniquely positioned to deliver breakthrough thermal performance through processes tailored to our customer needs," said Steve Rummel, Senior Vice President, Engineered Materials Business Group at Coherent.

The company combines diamond growth, surface finishing, coating technologies, and semiconductor process expertise to manufacture the thermal spreaders. Coherent stated it partners with customers to address thermal and process-integration challenges on die sizes up to 100mm. The bondable diamond can be combined with other company materials and may incorporate conductive elements, vias, channels, and optical structures.

The information is based on a company press release statement.

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