Trane Technologies and Eaton launch joint AI data center design

Trane Technologies (NYSE: TT) and Eaton (NYSE: ETN) announced a collaboration to integrate thermal management and electrical system architectures for AI data centers, according to a joint press release from the companies.

The two companies introduced a reference design that combines power and cooling systems for next-generation data centers. The design targets medium-voltage configurations for higher-power density facilities and is built to align with the Nvidia DSX AI Factory Reference Design platform.

The companies claim the integrated approach can achieve energy efficiency gains of up to 15%, reduce copper use by as much as 80%, and cut installation costs by up to 30% compared to conventional low-voltage designs. The reference design is included in both the Trane Continuum Rubin DSX and Eaton Beam Rubin DSX platforms.

The design is also built to work with the Nvidia Omniverse DSX Blueprint for AI data centers. Eaton's technology provides power distribution support for the Trane platform, while both companies' thermal and electrical systems are intended to exchange data and respond dynamically to operational demands.

"By combining our advanced thermal management solutions with Eaton's innovative power management solutions, we're delivering a coordinated design that helps customers accelerate deployment, improve efficiency and confidently plan to scale for the future," said Mauro J. Atalla, Senior Vice President and Chief Technology and Sustainability Officer at Trane Technologies.

Vladimir Troy, Vice President of AI Infrastructure at Nvidia, said the integrated approach supports customers in reducing complexity and accelerating deployment of AI data centers aligned with the Nvidia Omniverse DSX Blueprint.

The reference design is described as adaptable to emerging liquid cooling technologies and direct current architectures as those become more widely adopted.

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