Synopsys expands Intel Foundry collaboration for Intel 14A process

Synopsys, Inc. (Nasdaq: SNPS) announced an expanded collaboration with Intel Foundry at the 2026 DAC Chips to Systems Conference, including the certification of AI-powered electronic design automation flows on Intel's 14A process technology.

The collaboration extends co-optimization across silicon, packaging, IP, and system domains. Synopsys said its 3DIC Compiler platform now supports Intel's Embedded Multi-die Interconnect Bridge (EMIB) and EMIB-T advanced packaging technologies, enabling multi-die chip designs with integrated power, thermal, and signal integrity analysis.

Synopsys also announced an expanded IP portfolio for Intel 14A, including interface IP such as 224G SerDes, PCIe 7.0, USB 4, and eUSB, along with foundation IP covering embedded memories, logic libraries, and input/output components.

"Angstrom-scale design is no longer only about extracting more power, performance, and area from a process node. It is about turning process innovation into predictable system-level outcomes," said Michael Buehler-Garcia, Senior Vice President at Synopsys.

Shawn Han, SVP and GM of Foundry Services at Intel Corporation, said the collaboration gives customers "greater ease of use and confidence to achieve their design goals."

Synopsys said its certified EDA flows and IP portfolio for Intel 18A and Intel 18A-P technologies remain available, with the Intel 14A support representing an extension of that existing work.

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