Fabric.AI and Kopin plan MicroLED optical interconnect demo at CES 2027

Fabric.AI (Nasdaq: FABC) and Kopin Corporation (Nasdaq: KOPN) confirmed that their Neural I/o™ MicroLED-based optical interconnect platform remains on schedule for a live demonstration at the Consumer Electronics Show in January 2027, according to a press release issued Aug. 11, 2026.

The demonstration would mark the first public showing of the platform, which the two companies have been jointly developing since at least May 2026, when Fabric.AI announced its intention to stage a demonstration. The companies say engineering, integration, and internal development milestones have been met in the months since.

Neural I/o™ uses a massively parallel array of MicroLEDs as its optical engine, trading per-lane speed for a higher lane count. The companies say this approach is designed to deliver higher aggregate bandwidth, lower energy per bit, reduced latency, and a smaller thermal footprint compared with conventional electrical interconnects such as copper traces and high-speed SerDes links.

"CES will be a defining moment for the platform — the first opportunity to put working technology in front of potential customers, strategic partners and the broader AI infrastructure ecosystem," said Josh Silverman, Chief Executive Officer of Fabric.AI.

The platform targets data-center interconnects linking GPUs, accelerators, pooled memory, and servers. Fabric.AI cited third-party projections to characterize the addressable market, including a TrendForce estimate that the optical interconnect market will exceed $39 billion by 2030. SNS Insider projected the co-packaged optics segment alone could approach $124 billion by 2032, at a compound annual growth rate above 26%. These figures have not been independently verified by the companies.

Fabric.AI describes itself as a fabless semiconductor company focused on AI infrastructure. Kopin provides optical systems and microdisplay technologies and holds the patented NeuralDisplay™ architecture that underlies the Neural I/o™ platform.

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