Applied Materials partners with Broadcom on AI chip packaging technology

Applied Materials Inc. (NASDAQ: AMAT) announced that Broadcom Inc. (NASDAQ: AVGO) will join its EPIC platform as an innovation partner to develop advanced chip packaging technologies for AI systems.

The partnership will focus on research and development to accelerate introduction of packaging technologies designed for next-generation AI chips. The collaboration will utilize Applied Materials' global network of innovation centers, including its new EPIC Center in Silicon Valley.

"The EPIC platform is designed to drive co-innovation across the ecosystem to change the way semiconductor technologies are developed and commercialized," said Gary Dickerson, president and CEO of Applied Materials. The partnership provides system designers early access to materials and process equipment innovations.

Charlie Kawwas, president of Broadcom's Semiconductor Solutions Group, said the collaboration combines Applied's materials engineering expertise with Broadcom's semiconductor and system design capabilities to accelerate time to market for AI innovations.

Through the partnership, Broadcom will access research and development work across Applied's global innovation centers, focusing on advanced packaging capabilities for connecting multiple chips within computing systems. The companies cited increasing industry adoption of advanced packaging techniques and heterogeneous integration to boost energy-efficient performance in AI systems.

Applied Materials' EPIC Center in Silicon Valley represents what the company describes as the largest U.S. investment in advanced semiconductor equipment research and development. The facility is designed to reduce commercialization time from early-stage research to full-scale manufacturing and is scheduled to become operational in 2026.

The information is based on a company press release statement.

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