Taiwan Semi (TSM) to Sink EUR 614M in ASML Holding's (ASML) Co-Invstment Program

Taiwan Semiconductor Mfg. Co. Ltd. (NYSE: TSM) announced it has joined ASML Holding N.V. (Nasdaq: ASML) Customer Co-Investment Program, aimed at accelerating the development and industrialization of key next-generation semiconductor manufacturing technologies, which include extreme ultraviolet (EUV) lithography technology and 450-millimeter lithography tools. The agreement includes an investment amount of €838 million in ASML to acquire a 5% of its equity; and to commit €276 million, spread over 5 years, to ASML’s research and development programs.

This agreement to develop key next generation lithography technologies is a natural extension of the long-term partnership between ASML and TSMC. ASML and TSMC collaborated successfully in the development of the 193-nanometer immersion lithography, and hope to help lead the industry again in the development of next generation lithography.

Taiwan Semi joins peer Intel (Nasdaq: INTC), which announced participation in the program in July.

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