FSI Int'l (FSII) Gets Multiple Orders for ANTARES CryoKinetic Cleaning Systems
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FSI International, Inc. (Nasdaq: FSII) reports that a leading device producer has placed orders for multiple ANTARES CryoKinetic Cleaning Systems, further broadening the platform’s installed base. The chip provider currently uses the ANTARES System for various particle removal processes and with this order, is adding capacity for advanced technology generations. The systems are expected to ship in fiscal 2012.
The ANTARES System is a fully automated, single-wafer, CryoKinetic system used for processing 200/300mm wafers with capabilities to remove nanoscale particles. CryoKinetic processing technology is an all-dry, chemical free process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films. The system’s highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL. Many of the leading logic device manufacturers worldwide utilize the ANTARES® System for its defect reduction and yield improvement benefits at 32/28 nm technology nodes.
The ANTARES System is a fully automated, single-wafer, CryoKinetic system used for processing 200/300mm wafers with capabilities to remove nanoscale particles. CryoKinetic processing technology is an all-dry, chemical free process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films. The system’s highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL. Many of the leading logic device manufacturers worldwide utilize the ANTARES® System for its defect reduction and yield improvement benefits at 32/28 nm technology nodes.
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