Rambus (RMBS), ITRI to Collaborate on 3D Packing Technology Development
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Rambus Inc. (Nasdaq: RMBS), is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan, on the development of interconnect and 3D packaging technologies.
In addition, Rambus has joined the Advanced Stacked-System Technology and Application Consortium (Ad-STAC), a multinational research association led by ITRI. Rambus and ITRI will work together as members of Ad-STAC on the development of system integration using silicon interposer technology. The collaboration combines ITRI’s strength in manufacturing and advanced process technologies as well as the strong system, package and signaling design experience of Rambus.
In addition, Rambus has joined the Advanced Stacked-System Technology and Application Consortium (Ad-STAC), a multinational research association led by ITRI. Rambus and ITRI will work together as members of Ad-STAC on the development of system integration using silicon interposer technology. The collaboration combines ITRI’s strength in manufacturing and advanced process technologies as well as the strong system, package and signaling design experience of Rambus.
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