3M (MMM), IBM (IBM) Enter Agreement to Create Semiconductor Stacking Adhesives
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3M (NYSE: MMM) and IBM (NYSE: IBM) have entered an agreement to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers of up to 100 separate chips.
Under the agreement, IBM will draw on its expertise in creating unique semiconductor packaging processes, and 3M will provide its expertise in developing and manufacturing adhesive materials.
Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications. Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Under the agreement, IBM will draw on its expertise in creating unique semiconductor packaging processes, and 3M will provide its expertise in developing and manufacturing adhesive materials.
Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications. Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
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