STATS ChipPAC Expands QFN Portfolio to Deliver Increased Functionality and Design Flexibility in a Thin Package Profile Nov 24, 2008 04:00PM

SINGAPORE -- 11/25/2008, UNITED STATES -- (MARKET WIRE) -- 11/24/08 -- STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES: S24), a leading semiconductor test and advanced packaging service provider, today announced it has expanded its Quad Flat No-lead (QFN) packaging portfolio with a strip etch version for applications requiring increased design flexibility and higher input/output (I/O) performance in a small, thin package profile. The new QFN package family, referred to as QFNs-se, features a significantly higher number of very thin I/O terminal pads as compared to conventional single or dual row QFN or leadframe-based Quad Flat Packages (QFP). The QFNs-se can accommodate three or more rows of terminals in a fine fixed or variable pitch, providing a wider pin count range of 50 to 250 I/O as compared to standard QFN packages which have 4 to 156 I/O. The QFNs-se is also considered to be a cost effective alternative to lower ball count Fine Pitch Ball Grid Array (FBGA) ...


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