3Leaf Systems to Showcase Scalable x86 SMP Systems at Supercomputing 2009
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Company to Demonstrate New Dynamic Data Center Solutions
SANTA CLARA, Calif.--(BUSINESS WIRE)-- 3Leaf Systems, an innovator of ASIC and software technologies that enable the dynamic data center, will showcase the company's recently launched Dynamic Data Center Solutions at Supercomputing 2009 (SC|09). 3Leaf Systems will demonstrate the application of the company's scalable x86-based shared memory systems for a variety of high-performance computing applications, including Computational Fluid Dynamics, Oil and Gas Reservoir Modeling and Bio-science research.
SC|09 is recognized globally as the premier international conference on high-performance computing, networking, storage and analysis. This premier international conference includes a globally attended technical program, workshops, tutorials, an exhibit area, demonstrations and hands-on learning. http://sc09.supercomputing.org/
Event: SC|09
Dates: November 16-20, 2009
Location: Portland Oregon Convention Center
3Leaf Systems Booth #3093
Booths: AMD Booth #1417
Supermicro Booth #2355
About 3Leaf Systems
3Leaf Systems develops innovative ASIC/software technologies that enable the Dynamic Data Center. 3Leaf Systems allows customers to merge previously separate CPU, I/O and memory resources from multiple x86-based systems into one large computing "fabric" so resources can be instantly delivered to demanding applications, just-in-time, as needed. By leveraging cost-optimized components to build performance-optimized systems, 3Leaf Systems solutions make data center infrastructure more agile and flexible while dramatically reducing capital and operational costs. A privately held company based in Santa Clara, Calif., investors in 3Leaf Systems include Alloy Ventures, Enterprise Partners, Intel Capital, LSI, and Storm Ventures. For more information, visit www.3leafsystems.com or call 408-572-5900.
Source: 3Leaf Systems
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