Celestica Inc. (NYSE: CLS) announced that its DS6000-series 1.6TbE switches are available for order to initial customers. The switches are designed for AI and machine learning infrastructure applications.

The DS6000-series includes two models: the air-cooled 3RU DS6000 for standard 19-inch racks and the hybrid-cooled 2OU DS6001 for 21-inch OCP ORv3 environments. Both models use Broadcom Tomahawk 6 switch silicon and deliver up to 102.4 Tbps of switching capacity.

The switches feature 64 ports of 1.6TbE connectivity using OSFP224 connectors. The platforms support both copper and optical interconnects and comply with Ultra Ethernet Consortium and Open Compute Project Ethernet Scale-up Network specifications.

"The move to 1.6TbE networking represents a monumental leap in data center evolution, and our engineering teams have worked tirelessly to ensure the DS6000-series is the definitive choice for the AI era," said Gavin Cato, SVP & GM, AI Platform Engineering at Celestica.

Hasan Siraj, Vice President of Product Management at Broadcom's Core Switching Group, said Celestica is among the first companies to ship systems using Tomahawk 6 silicon. The collaboration addresses bandwidth demands for generative AI applications.

TD SYNNEX, a distribution partner, confirmed customer demand for 1.6T bandwidth solutions. Dell'Oro Group noted Celestica's position in high-speed data center switch port shipments.

Celestica will demonstrate the DS6001 at the OCP Regional Summit in Barcelona from April 29-30. The company manufactures data center infrastructure and provides platform solutions for AI, cloud, and hybrid cloud applications.