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   <title>Bain Capital sets sights on $500 mln Kioxia IPO - Bloomberg report</title>
   <link>http://www.streetinsider.com/Investing/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</link>
   <description>&lt;p dir=&quot;ltr&quot;&gt;Investing.com -- &lt;span itemscope itemtype=&quot;http://schema.org/Corporation&quot;&gt;&lt;span itemprop=&quot;name&quot;&gt; Bain Capital Specialty Finance &lt;/span&gt;&lt;/span&gt; Inc (NYSE:BCSF) is moving forward with plans to launch an initial public offering (IPO) for Kioxia Holdings Corp., aiming to raise around $500 million, as per a Bloomberg report. &lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The private equity firm is working with investment banks to prepare for the listing of the Japanese NAND flash memory business, which could potentially launch as early as the coming weeks, the report said.&lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The Nikkei reported that Kioxia has filed for an October IPO, with an anticipated valuation exceeding 1.5 trillion yen ($10.3 billion). If successful, Kioxia's IPO</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Investing/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</guid>
   <pubDate>Fri, 23 Aug 2024 06:10:16 -0400</pubDate>
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   <title>Bain Capital sets sights on $500 mln Kioxia IPO - Bloomberg report</title>
   <link>http://www.streetinsider.com/Investing/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</link>
   <description>&lt;p dir=&quot;ltr&quot;&gt;Investing.com -- &lt;span itemscope itemtype=&quot;http://schema.org/Corporation&quot;&gt;&lt;span itemprop=&quot;name&quot;&gt; Bain Capital Specialty Finance &lt;/span&gt;&lt;/span&gt; Inc (NYSE:BCSF) is moving forward with plans to launch an initial public offering (IPO) for Kioxia Holdings Corp., aiming to raise around $500 million, as per a Bloomberg report. &lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The private equity firm is working with investment banks to prepare for the listing of the Japanese NAND flash memory business, which could potentially launch as early as the coming weeks, the report said.&lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The Nikkei reported that Kioxia has filed for an October IPO, with an anticipated valuation exceeding 1.5 trillion yen ($10.3 billion). If successful, Kioxia's IPO</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Investing/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</guid>
   <pubDate>Fri, 23 Aug 2024 06:10:16 -0400</pubDate>
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   <title>Bain Capital sets sights on $500 mln Kioxia IPO - Bloomberg report</title>
   <link>http://www.streetinsider.com/Investing/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</link>
   <description>&lt;p dir=&quot;ltr&quot;&gt;Investing.com -- &lt;span itemscope itemtype=&quot;http://schema.org/Corporation&quot;&gt;&lt;span itemprop=&quot;name&quot;&gt; Bain Capital Specialty Finance &lt;/span&gt;&lt;/span&gt; Inc (NYSE:BCSF) is moving forward with plans to launch an initial public offering (IPO) for Kioxia Holdings Corp., aiming to raise around $500 million, as per a Bloomberg report. &lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The private equity firm is working with investment banks to prepare for the listing of the Japanese NAND flash memory business, which could potentially launch as early as the coming weeks, the report said.&lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The Nikkei reported that Kioxia has filed for an October IPO, with an anticipated valuation exceeding 1.5 trillion yen ($10.3 billion). If successful, Kioxia's IPO</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Investing/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</guid>
   <pubDate>Fri, 23 Aug 2024 06:10:16 -0400</pubDate>
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   <title>Bain Capital sets sights on $500 mln Kioxia IPO - Bloomberg report</title>
   <link>http://www.streetinsider.com/Investing/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</link>
   <description>&lt;p dir=&quot;ltr&quot;&gt;Investing.com -- &lt;span itemscope itemtype=&quot;http://schema.org/Corporation&quot;&gt;&lt;span itemprop=&quot;name&quot;&gt; Bain Capital Specialty Finance &lt;/span&gt;&lt;/span&gt; Inc (NYSE:BCSF) is moving forward with plans to launch an initial public offering (IPO) for Kioxia Holdings Corp., aiming to raise around $500 million, as per a Bloomberg report. &lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The private equity firm is working with investment banks to prepare for the listing of the Japanese NAND flash memory business, which could potentially launch as early as the coming weeks, the report said.&lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The Nikkei reported that Kioxia has filed for an October IPO, with an anticipated valuation exceeding 1.5 trillion yen ($10.3 billion). If successful, Kioxia's IPO</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Investing/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</guid>
   <pubDate>Fri, 23 Aug 2024 06:10:16 -0400</pubDate>
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   <title>Bain Capital sets sights on $500 mln Kioxia IPO - Bloomberg report</title>
   <link>http://www.streetinsider.com/IPOs/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</link>
   <description>&lt;p dir=&quot;ltr&quot;&gt;Investing.com -- &lt;span itemscope itemtype=&quot;http://schema.org/Corporation&quot;&gt;&lt;span itemprop=&quot;name&quot;&gt; Bain Capital Specialty Finance &lt;/span&gt;&lt;/span&gt; Inc (NYSE:BCSF) is moving forward with plans to launch an initial public offering (IPO) for Kioxia Holdings Corp., aiming to raise around $500 million, as per a Bloomberg report. &lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The private equity firm is working with investment banks to prepare for the listing of the Japanese NAND flash memory business, which could potentially launch as early as the coming weeks, the report said.&lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The Nikkei reported that Kioxia has filed for an October IPO, with an anticipated valuation exceeding 1.5 trillion yen ($10.3 billion). If successful, Kioxia's IPO</description>
   <guid isPermaLink="true">http://www.streetinsider.com/IPOs/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</guid>
   <pubDate>Fri, 23 Aug 2024 06:10:16 -0400</pubDate>
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   <title>Bain Capital sets sights on $500 mln Kioxia IPO - Bloomberg report</title>
   <link>http://www.streetinsider.com/IPOs/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</link>
   <description>&lt;p dir=&quot;ltr&quot;&gt;Investing.com -- &lt;span itemscope itemtype=&quot;http://schema.org/Corporation&quot;&gt;&lt;span itemprop=&quot;name&quot;&gt; Bain Capital Specialty Finance &lt;/span&gt;&lt;/span&gt; Inc (NYSE:BCSF) is moving forward with plans to launch an initial public offering (IPO) for Kioxia Holdings Corp., aiming to raise around $500 million, as per a Bloomberg report. &lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The private equity firm is working with investment banks to prepare for the listing of the Japanese NAND flash memory business, which could potentially launch as early as the coming weeks, the report said.&lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The Nikkei reported that Kioxia has filed for an October IPO, with an anticipated valuation exceeding 1.5 trillion yen ($10.3 billion). If successful, Kioxia's IPO</description>
   <guid isPermaLink="true">http://www.streetinsider.com/IPOs/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</guid>
   <pubDate>Fri, 23 Aug 2024 06:10:16 -0400</pubDate>
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   <title>Bain Capital sets sights on $500 mln Kioxia IPO - Bloomberg report</title>
   <link>http://www.streetinsider.com/IPOs/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</link>
   <description>&lt;p dir=&quot;ltr&quot;&gt;Investing.com -- &lt;span itemscope itemtype=&quot;http://schema.org/Corporation&quot;&gt;&lt;span itemprop=&quot;name&quot;&gt; Bain Capital Specialty Finance &lt;/span&gt;&lt;/span&gt; Inc (NYSE:BCSF) is moving forward with plans to launch an initial public offering (IPO) for Kioxia Holdings Corp., aiming to raise around $500 million, as per a Bloomberg report. &lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The private equity firm is working with investment banks to prepare for the listing of the Japanese NAND flash memory business, which could potentially launch as early as the coming weeks, the report said.&lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The Nikkei reported that Kioxia has filed for an October IPO, with an anticipated valuation exceeding 1.5 trillion yen ($10.3 billion). If successful, Kioxia's IPO</description>
   <guid isPermaLink="true">http://www.streetinsider.com/IPOs/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</guid>
   <pubDate>Fri, 23 Aug 2024 06:10:16 -0400</pubDate>
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   <title>Bain Capital sets sights on $500 mln Kioxia IPO - Bloomberg report</title>
   <link>http://www.streetinsider.com/IPOs/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</link>
   <description>&lt;p dir=&quot;ltr&quot;&gt;Investing.com -- &lt;span itemscope itemtype=&quot;http://schema.org/Corporation&quot;&gt;&lt;span itemprop=&quot;name&quot;&gt; Bain Capital Specialty Finance &lt;/span&gt;&lt;/span&gt; Inc (NYSE:BCSF) is moving forward with plans to launch an initial public offering (IPO) for Kioxia Holdings Corp., aiming to raise around $500 million, as per a Bloomberg report. &lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The private equity firm is working with investment banks to prepare for the listing of the Japanese NAND flash memory business, which could potentially launch as early as the coming weeks, the report said.&lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The Nikkei reported that Kioxia has filed for an October IPO, with an anticipated valuation exceeding 1.5 trillion yen ($10.3 billion). If successful, Kioxia's IPO</description>
   <guid isPermaLink="true">http://www.streetinsider.com/IPOs/Bain+Capital+sets+sights+on+%24500+mln+Kioxia+IPO+-+Bloomberg+report/23636353.html</guid>
   <pubDate>Fri, 23 Aug 2024 06:10:16 -0400</pubDate>
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   <title>Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors</title>
   <link>http://www.streetinsider.com/Press+Releases/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</link>
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&lt;p&gt;    KAWASAKI, Japan--(BUSINESS WIRE)--
&lt;a target=&quot;_blank&quot; rel=&quot;nofollow&quot; href=&quot;https://cts.businesswire.com/ct/CT?id=smartlink&amp;amp;url=https%3A%2F%2Ftoshiba.semicon-storage.com%2Fap-en%2Ftop.html&amp;amp;esheet=54014520&amp;amp;newsitemid=20240522131945&amp;amp;lan=en-US&amp;amp;anchor=Toshiba+Electronic+Devices+%26amp%3B+Storage+Corporation&amp;amp;index=1&amp;amp;md5=d66fb2c9ae44376d6f536db591795f80&quot; shape=&quot;rect&quot;&gt;Toshiba Electronic Devices &amp;amp; Storage Corporation&lt;/a&gt; (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024. Once Phase 1 reaches full-scale operation, Toshiba’s production capacity for power</description>
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   <pubDate>Thu, 23 May 2024 02:41:00 -0400</pubDate>
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   <title>Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors</title>
   <link>http://www.streetinsider.com/Press+Releases/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</link>
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&lt;p&gt;    KAWASAKI, Japan--(BUSINESS WIRE)--
&lt;a target=&quot;_blank&quot; rel=&quot;nofollow&quot; href=&quot;https://cts.businesswire.com/ct/CT?id=smartlink&amp;amp;url=https%3A%2F%2Ftoshiba.semicon-storage.com%2Fap-en%2Ftop.html&amp;amp;esheet=54014520&amp;amp;newsitemid=20240522131945&amp;amp;lan=en-US&amp;amp;anchor=Toshiba+Electronic+Devices+%26amp%3B+Storage+Corporation&amp;amp;index=1&amp;amp;md5=d66fb2c9ae44376d6f536db591795f80&quot; shape=&quot;rect&quot;&gt;Toshiba Electronic Devices &amp;amp; Storage Corporation&lt;/a&gt; (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024. Once Phase 1 reaches full-scale operation, Toshiba’s production capacity for power</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Press+Releases/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</guid>
   <pubDate>Thu, 23 May 2024 02:41:00 -0400</pubDate>
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   <title>Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors</title>
   <link>http://www.streetinsider.com/Press+Releases/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</link>
   <description>
&lt;p&gt;    KAWASAKI, Japan--(BUSINESS WIRE)--
&lt;a target=&quot;_blank&quot; rel=&quot;nofollow&quot; href=&quot;https://cts.businesswire.com/ct/CT?id=smartlink&amp;amp;url=https%3A%2F%2Ftoshiba.semicon-storage.com%2Fap-en%2Ftop.html&amp;amp;esheet=54014520&amp;amp;newsitemid=20240522131945&amp;amp;lan=en-US&amp;amp;anchor=Toshiba+Electronic+Devices+%26amp%3B+Storage+Corporation&amp;amp;index=1&amp;amp;md5=d66fb2c9ae44376d6f536db591795f80&quot; shape=&quot;rect&quot;&gt;Toshiba Electronic Devices &amp;amp; Storage Corporation&lt;/a&gt; (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024. Once Phase 1 reaches full-scale operation, Toshiba’s production capacity for power</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Press+Releases/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</guid>
   <pubDate>Thu, 23 May 2024 02:41:00 -0400</pubDate>
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   <title>Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors</title>
   <link>http://www.streetinsider.com/Press+Releases/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</link>
   <description>
&lt;p&gt;    KAWASAKI, Japan--(BUSINESS WIRE)--
&lt;a target=&quot;_blank&quot; rel=&quot;nofollow&quot; href=&quot;https://cts.businesswire.com/ct/CT?id=smartlink&amp;amp;url=https%3A%2F%2Ftoshiba.semicon-storage.com%2Fap-en%2Ftop.html&amp;amp;esheet=54014520&amp;amp;newsitemid=20240522131945&amp;amp;lan=en-US&amp;amp;anchor=Toshiba+Electronic+Devices+%26amp%3B+Storage+Corporation&amp;amp;index=1&amp;amp;md5=d66fb2c9ae44376d6f536db591795f80&quot; shape=&quot;rect&quot;&gt;Toshiba Electronic Devices &amp;amp; Storage Corporation&lt;/a&gt; (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024. Once Phase 1 reaches full-scale operation, Toshiba’s production capacity for power</description>
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   <pubDate>Thu, 23 May 2024 02:41:00 -0400</pubDate>
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   <title>Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors</title>
   <link>http://www.streetinsider.com/Press+Releases/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</link>
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&lt;p&gt;    KAWASAKI, Japan--(BUSINESS WIRE)--
&lt;a target=&quot;_blank&quot; rel=&quot;nofollow&quot; href=&quot;https://cts.businesswire.com/ct/CT?id=smartlink&amp;amp;url=https%3A%2F%2Ftoshiba.semicon-storage.com%2Fap-en%2Ftop.html&amp;amp;esheet=54014520&amp;amp;newsitemid=20240522131945&amp;amp;lan=en-US&amp;amp;anchor=Toshiba+Electronic+Devices+%26amp%3B+Storage+Corporation&amp;amp;index=1&amp;amp;md5=d66fb2c9ae44376d6f536db591795f80&quot; shape=&quot;rect&quot;&gt;Toshiba Electronic Devices &amp;amp; Storage Corporation&lt;/a&gt; (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024. Once Phase 1 reaches full-scale operation, Toshiba’s production capacity for power</description>
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   <pubDate>Thu, 23 May 2024 02:41:00 -0400</pubDate>
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   <title>Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors</title>
   <link>http://www.streetinsider.com/Press+Releases/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</link>
   <description>
&lt;p&gt;    KAWASAKI, Japan--(BUSINESS WIRE)--
&lt;a target=&quot;_blank&quot; rel=&quot;nofollow&quot; href=&quot;https://cts.businesswire.com/ct/CT?id=smartlink&amp;amp;url=https%3A%2F%2Ftoshiba.semicon-storage.com%2Fap-en%2Ftop.html&amp;amp;esheet=54014520&amp;amp;newsitemid=20240522131945&amp;amp;lan=en-US&amp;amp;anchor=Toshiba+Electronic+Devices+%26amp%3B+Storage+Corporation&amp;amp;index=1&amp;amp;md5=d66fb2c9ae44376d6f536db591795f80&quot; shape=&quot;rect&quot;&gt;Toshiba Electronic Devices &amp;amp; Storage Corporation&lt;/a&gt; (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024. Once Phase 1 reaches full-scale operation, Toshiba’s production capacity for power</description>
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   <pubDate>Thu, 23 May 2024 02:41:00 -0400</pubDate>
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   <title>Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors</title>
   <link>http://www.streetinsider.com/Press+Releases/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</link>
   <description>
&lt;p&gt;    KAWASAKI, Japan--(BUSINESS WIRE)--
&lt;a target=&quot;_blank&quot; rel=&quot;nofollow&quot; href=&quot;https://cts.businesswire.com/ct/CT?id=smartlink&amp;amp;url=https%3A%2F%2Ftoshiba.semicon-storage.com%2Fap-en%2Ftop.html&amp;amp;esheet=54014520&amp;amp;newsitemid=20240522131945&amp;amp;lan=en-US&amp;amp;anchor=Toshiba+Electronic+Devices+%26amp%3B+Storage+Corporation&amp;amp;index=1&amp;amp;md5=d66fb2c9ae44376d6f536db591795f80&quot; shape=&quot;rect&quot;&gt;Toshiba Electronic Devices &amp;amp; Storage Corporation&lt;/a&gt; (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024. Once Phase 1 reaches full-scale operation, Toshiba’s production capacity for power</description>
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   <pubDate>Thu, 23 May 2024 02:41:00 -0400</pubDate>
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   <title>Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors</title>
   <link>http://www.streetinsider.com/Business+Wire/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</link>
   <description>
&lt;p&gt;    KAWASAKI, Japan--(BUSINESS WIRE)--
&lt;a target=&quot;_blank&quot; rel=&quot;nofollow&quot; href=&quot;https://cts.businesswire.com/ct/CT?id=smartlink&amp;amp;url=https%3A%2F%2Ftoshiba.semicon-storage.com%2Fap-en%2Ftop.html&amp;amp;esheet=54014520&amp;amp;newsitemid=20240522131945&amp;amp;lan=en-US&amp;amp;anchor=Toshiba+Electronic+Devices+%26amp%3B+Storage+Corporation&amp;amp;index=1&amp;amp;md5=d66fb2c9ae44376d6f536db591795f80&quot; shape=&quot;rect&quot;&gt;Toshiba Electronic Devices &amp;amp; Storage Corporation&lt;/a&gt; (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024. Once Phase 1 reaches full-scale operation, Toshiba’s production capacity for power</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Business+Wire/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</guid>
   <pubDate>Thu, 23 May 2024 02:41:00 -0400</pubDate>
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   <title>Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors</title>
   <link>http://www.streetinsider.com/Business+Wire/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</link>
   <description>
&lt;p&gt;    KAWASAKI, Japan--(BUSINESS WIRE)--
&lt;a target=&quot;_blank&quot; rel=&quot;nofollow&quot; href=&quot;https://cts.businesswire.com/ct/CT?id=smartlink&amp;amp;url=https%3A%2F%2Ftoshiba.semicon-storage.com%2Fap-en%2Ftop.html&amp;amp;esheet=54014520&amp;amp;newsitemid=20240522131945&amp;amp;lan=en-US&amp;amp;anchor=Toshiba+Electronic+Devices+%26amp%3B+Storage+Corporation&amp;amp;index=1&amp;amp;md5=d66fb2c9ae44376d6f536db591795f80&quot; shape=&quot;rect&quot;&gt;Toshiba Electronic Devices &amp;amp; Storage Corporation&lt;/a&gt; (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024. Once Phase 1 reaches full-scale operation, Toshiba’s production capacity for power</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Business+Wire/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</guid>
   <pubDate>Thu, 23 May 2024 02:41:00 -0400</pubDate>
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   <title>Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors</title>
   <link>http://www.streetinsider.com/Business+Wire/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</link>
   <description>
&lt;p&gt;    KAWASAKI, Japan--(BUSINESS WIRE)--
&lt;a target=&quot;_blank&quot; rel=&quot;nofollow&quot; href=&quot;https://cts.businesswire.com/ct/CT?id=smartlink&amp;amp;url=https%3A%2F%2Ftoshiba.semicon-storage.com%2Fap-en%2Ftop.html&amp;amp;esheet=54014520&amp;amp;newsitemid=20240522131945&amp;amp;lan=en-US&amp;amp;anchor=Toshiba+Electronic+Devices+%26amp%3B+Storage+Corporation&amp;amp;index=1&amp;amp;md5=d66fb2c9ae44376d6f536db591795f80&quot; shape=&quot;rect&quot;&gt;Toshiba Electronic Devices &amp;amp; Storage Corporation&lt;/a&gt; (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024. Once Phase 1 reaches full-scale operation, Toshiba’s production capacity for power</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Business+Wire/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</guid>
   <pubDate>Thu, 23 May 2024 02:41:00 -0400</pubDate>
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   <title>Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors</title>
   <link>http://www.streetinsider.com/Business+Wire/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</link>
   <description>
&lt;p&gt;    KAWASAKI, Japan--(BUSINESS WIRE)--
&lt;a target=&quot;_blank&quot; rel=&quot;nofollow&quot; href=&quot;https://cts.businesswire.com/ct/CT?id=smartlink&amp;amp;url=https%3A%2F%2Ftoshiba.semicon-storage.com%2Fap-en%2Ftop.html&amp;amp;esheet=54014520&amp;amp;newsitemid=20240522131945&amp;amp;lan=en-US&amp;amp;anchor=Toshiba+Electronic+Devices+%26amp%3B+Storage+Corporation&amp;amp;index=1&amp;amp;md5=d66fb2c9ae44376d6f536db591795f80&quot; shape=&quot;rect&quot;&gt;Toshiba Electronic Devices &amp;amp; Storage Corporation&lt;/a&gt; (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024. Once Phase 1 reaches full-scale operation, Toshiba’s production capacity for power</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Business+Wire/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</guid>
   <pubDate>Thu, 23 May 2024 02:41:00 -0400</pubDate>
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   <title>Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors</title>
   <link>http://www.streetinsider.com/Business+Wire/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</link>
   <description>
&lt;p&gt;    KAWASAKI, Japan--(BUSINESS WIRE)--
&lt;a target=&quot;_blank&quot; rel=&quot;nofollow&quot; href=&quot;https://cts.businesswire.com/ct/CT?id=smartlink&amp;amp;url=https%3A%2F%2Ftoshiba.semicon-storage.com%2Fap-en%2Ftop.html&amp;amp;esheet=54014520&amp;amp;newsitemid=20240522131945&amp;amp;lan=en-US&amp;amp;anchor=Toshiba+Electronic+Devices+%26amp%3B+Storage+Corporation&amp;amp;index=1&amp;amp;md5=d66fb2c9ae44376d6f536db591795f80&quot; shape=&quot;rect&quot;&gt;Toshiba Electronic Devices &amp;amp; Storage Corporation&lt;/a&gt; (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024. Once Phase 1 reaches full-scale operation, Toshiba’s production capacity for power</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Business+Wire/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</guid>
   <pubDate>Thu, 23 May 2024 02:41:00 -0400</pubDate>
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   <title>Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors</title>
   <link>http://www.streetinsider.com/Business+Wire/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</link>
   <description>
&lt;p&gt;    KAWASAKI, Japan--(BUSINESS WIRE)--
&lt;a target=&quot;_blank&quot; rel=&quot;nofollow&quot; href=&quot;https://cts.businesswire.com/ct/CT?id=smartlink&amp;amp;url=https%3A%2F%2Ftoshiba.semicon-storage.com%2Fap-en%2Ftop.html&amp;amp;esheet=54014520&amp;amp;newsitemid=20240522131945&amp;amp;lan=en-US&amp;amp;anchor=Toshiba+Electronic+Devices+%26amp%3B+Storage+Corporation&amp;amp;index=1&amp;amp;md5=d66fb2c9ae44376d6f536db591795f80&quot; shape=&quot;rect&quot;&gt;Toshiba Electronic Devices &amp;amp; Storage Corporation&lt;/a&gt; (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024. Once Phase 1 reaches full-scale operation, Toshiba’s production capacity for power</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Business+Wire/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</guid>
   <pubDate>Thu, 23 May 2024 02:41:00 -0400</pubDate>
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   <title>Toshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors</title>
   <link>http://www.streetinsider.com/Business+Wire/Toshiba+Completes+New+300-Millimeter+Wafer+Fabrication+Facility+for+Power+Semiconductors/23266244.html</link>
   <description>
&lt;p&gt;    KAWASAKI, Japan--(BUSINESS WIRE)--
&lt;a target=&quot;_blank&quot; rel=&quot;nofollow&quot; href=&quot;https://cts.businesswire.com/ct/CT?id=smartlink&amp;amp;url=https%3A%2F%2Ftoshiba.semicon-storage.com%2Fap-en%2Ftop.html&amp;amp;esheet=54014520&amp;amp;newsitemid=20240522131945&amp;amp;lan=en-US&amp;amp;anchor=Toshiba+Electronic+Devices+%26amp%3B+Storage+Corporation&amp;amp;index=1&amp;amp;md5=d66fb2c9ae44376d6f536db591795f80&quot; shape=&quot;rect&quot;&gt;Toshiba Electronic Devices &amp;amp; Storage Corporation&lt;/a&gt; (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024. Once Phase 1 reaches full-scale operation, Toshiba’s production capacity for power</description>
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   <pubDate>Thu, 23 May 2024 02:41:00 -0400</pubDate>
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   <title>Japan’s Kioxia, Western Digital to resume merger talks in April- Asahi</title>
   <link>http://www.streetinsider.com/Investing/Japan%E2%80%99s+Kioxia%2C+Western+Digital+to+resume+merger+talks+in+April-+Asahi/22820755.html</link>
   <description>&lt;p&gt;Investing.com-- Semiconductor maker Kioxia Holdings and U.S. partner &lt;span itemscope itemtype=&quot;http://schema.org/Corporation&quot;&gt;&lt;span itemprop=&quot;name&quot;&gt; Western Digital &lt;/span&gt;&lt;/span&gt; Corporation (NASDAQ:WDC) will resume negotiations for a potential merger in late-April 2024, Japanese newspaper Asahi Shimbun reported on Friday.&lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The report comes after talks over a potential merger fell through in October 2023, after opposition from memory chipmaker &lt;span itemscope itemtype=&quot;http://schema.org/Corporation&quot;&gt;&lt;span itemprop=&quot;name&quot;&gt; SK Hynix Inc &lt;/span&gt;&lt;/span&gt; (KS:000660), which is a stakeholder in Kioxia.&lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;WD and Kioxia will have to wait for a set period of time before resuming negotiations, Asahi reported, citing officials familiar with the matter. &lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The deal, if completed, stands to form one</description>
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   <pubDate>Thu, 22 Feb 2024 19:13:25 -0400</pubDate>
      	<category domain="http://rss.financialcontent.com/stocksymbol">TOSYY</category>
   	   	<category domain="http://rss.financialcontent.com/stocksymbol">WDC</category>
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  <item>
   <title>Japan’s Kioxia, Western Digital to resume merger talks in April- Asahi</title>
   <link>http://www.streetinsider.com/Investing/Japan%E2%80%99s+Kioxia%2C+Western+Digital+to+resume+merger+talks+in+April-+Asahi/22820755.html</link>
   <description>&lt;p&gt;Investing.com-- Semiconductor maker Kioxia Holdings and U.S. partner &lt;span itemscope itemtype=&quot;http://schema.org/Corporation&quot;&gt;&lt;span itemprop=&quot;name&quot;&gt; Western Digital &lt;/span&gt;&lt;/span&gt; Corporation (NASDAQ:WDC) will resume negotiations for a potential merger in late-April 2024, Japanese newspaper Asahi Shimbun reported on Friday.&lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The report comes after talks over a potential merger fell through in October 2023, after opposition from memory chipmaker &lt;span itemscope itemtype=&quot;http://schema.org/Corporation&quot;&gt;&lt;span itemprop=&quot;name&quot;&gt; SK Hynix Inc &lt;/span&gt;&lt;/span&gt; (KS:000660), which is a stakeholder in Kioxia.&lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;WD and Kioxia will have to wait for a set period of time before resuming negotiations, Asahi reported, citing officials familiar with the matter. &lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The deal, if completed, stands to form one</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Investing/Japan%E2%80%99s+Kioxia%2C+Western+Digital+to+resume+merger+talks+in+April-+Asahi/22820755.html</guid>
   <pubDate>Thu, 22 Feb 2024 19:13:25 -0400</pubDate>
      	<category domain="http://rss.financialcontent.com/stocksymbol">TOSYY</category>
   	   	<category domain="http://rss.financialcontent.com/stocksymbol">WDC</category>
   	  </item>
  <item>
   <title>Japan’s Kioxia, Western Digital to resume merger talks in April- Asahi</title>
   <link>http://www.streetinsider.com/Hot+M+and+A/Japan%E2%80%99s+Kioxia%2C+Western+Digital+to+resume+merger+talks+in+April-+Asahi/22820755.html</link>
   <description>&lt;p&gt;Investing.com-- Semiconductor maker Kioxia Holdings and U.S. partner &lt;span itemscope itemtype=&quot;http://schema.org/Corporation&quot;&gt;&lt;span itemprop=&quot;name&quot;&gt; Western Digital &lt;/span&gt;&lt;/span&gt; Corporation (NASDAQ:WDC) will resume negotiations for a potential merger in late-April 2024, Japanese newspaper Asahi Shimbun reported on Friday.&lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The report comes after talks over a potential merger fell through in October 2023, after opposition from memory chipmaker &lt;span itemscope itemtype=&quot;http://schema.org/Corporation&quot;&gt;&lt;span itemprop=&quot;name&quot;&gt; SK Hynix Inc &lt;/span&gt;&lt;/span&gt; (KS:000660), which is a stakeholder in Kioxia.&lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;WD and Kioxia will have to wait for a set period of time before resuming negotiations, Asahi reported, citing officials familiar with the matter. &lt;/p&gt;
&lt;p dir=&quot;ltr&quot;&gt;The deal, if completed, stands to form one</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Hot+M+and+A/Japan%E2%80%99s+Kioxia%2C+Western+Digital+to+resume+merger+talks+in+April-+Asahi/22820755.html</guid>
   <pubDate>Thu, 22 Feb 2024 19:13:25 -0400</pubDate>
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   	   	<category domain="http://rss.financialcontent.com/stocksymbol">WDC</category>
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