Form 144 TERADYNE, INC Filed by: Smith Gregory Stephen

Thu, 15 Oct 2026 10:13:00 -0400

si-local-file:///var/storage/secattach/20261015/27191524.html

Form 144 TERADYNE, INC Filed by: MATZ MARILYN

Thu, 15 Oct 2026 09:52:00 -0400

si-local-file:///var/storage/secattach/20261015/27191257.html

Teradyne to Announce Third Quarter 2026 Results

Tue, 13 Oct 2026 16:30:00 -0400

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (NASDAQ: TER) will release financial results for the third quarter 2026 on Tuesday, October 27, 2026 at 4:30 p.m. Eastern Time (ET) or later.

A conference call to discuss the third quarter results, along with management's business outlook, will follow at 8:30 a.m. ET, Wednesday, October 28, 2026.

Interested investors should access the webcast at investors.teradyne.com/events-presentations at least five minutes before the call begins. Presentation materials will be available starting at 7:30 a.m. ET.

A replay will be available on the Teradyne website at

Teradyne to Announce Third Quarter 2026 Results

Tue, 13 Oct 2026 16:30:00 -0400

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (NASDAQ: TER) will release financial results for the third quarter 2026 on Tuesday, October 27, 2026 at 4:30 p.m. Eastern Time (ET) or later.

A conference call to discuss the third quarter results, along with management's business outlook, will follow at 8:30 a.m. ET, Wednesday, October 28, 2026.

A replay will be available on the Teradyne website at

FormFactor stock rises on $300M Teradyne investment deal

Mon, 12 Oct 2026 16:48:30 -0400

Investing.com -- FormFactor Inc (NASDAQ:FORM) shares rose 3.6% in after-hours trading Monday following the announcement of a strategic technology collaboration with Teradyne Inc (NASDAQ:TER) and a $300 million equity investment from the automated test equipment provider.

The partnership brings together FormFactor's probe technologies and interface solutions with Teradyne's automated test platforms to address semiconductor testing challenges. The collaboration will focus on advancing test architectures for high-performance compute, advanced packaging, high-bandwidth memory, and silicon photonics applications.

Under the agreement, Teradyne will purchase $300 million in FormFactor common stock. The transaction is subject to customary closing conditions and

FormFactor stock rises on $300M Teradyne investment deal

Mon, 12 Oct 2026 16:48:30 -0400

Under the agreement, Teradyne will purchase $300 million in FormFactor common stock. The transaction is subject to customary closing conditions and

FormFactor stock rises on $300M Teradyne investment deal

Mon, 12 Oct 2026 16:48:30 -0400

Under the agreement, Teradyne will purchase $300 million in FormFactor common stock. The transaction is subject to customary closing conditions and

FormFactor stock rises on $300M Teradyne investment deal

Mon, 12 Oct 2026 16:48:30 -0400

Under the agreement, Teradyne will purchase $300 million in FormFactor common stock. The transaction is subject to customary closing conditions and

Teradyne to invest $300M in FormFactor in semiconductor test deal

Mon, 12 Oct 2026 16:01:17 -0400

FormFactor, Inc. (Nasdaq: FORM) and Teradyne, Inc. (Nasdaq: TER) announced a technology collaboration and a $300 million strategic equity investment by Teradyne in FormFactor, according to a joint press release dated Oct. 12, 2026.

Under the agreement, Teradyne will purchase shares of FormFactor common stock. The transaction is subject to customary closing conditions and regulatory approvals.

The collaboration is intended to advance semiconductor test architectures and production readiness for applications including high-performance compute, advanced packaging, high-bandwidth memory, and silicon photonics.

"The semiconductor industry is entering a period where test performance, scalability, and time-to-market are becoming decisive competitive advantages," said Mike Slessor, Chief Executive

Teradyne to invest $300M in FormFactor in semiconductor test deal

Mon, 12 Oct 2026 16:01:17 -0400

Under the agreement, Teradyne will purchase shares of FormFactor common stock. The transaction is subject to customary closing conditions and regulatory approvals.

"The semiconductor industry is entering a period where test performance, scalability, and time-to-market are becoming decisive competitive advantages," said Mike Slessor, Chief Executive

FormFactor and Teradyne Announce Strategic Collaboration to Accelerate Next-Generation Semiconductor Testing

Mon, 12 Oct 2026 16:01:00 -0400

LIVERMORE, Calif., Oct. 12, 2026 (GLOBE NEWSWIRE) -- FormFactor, Inc. (Nasdaq: FORM), a leading provider of semiconductor test and measurement technologies, and Teradyne, Inc. (Nasdaq: TER), a leading provider of automated test equipment and advanced robotics, today announced the two companies have entered into a broad technology collaboration aimed at accelerating the development, validation, and high-volume production deployment of next-generation semiconductor devices. In addition, Teradyne has agreed to purchase shares of FormFactor common stock.

The collaboration brings together FormFactor’s industry-leading expertise in probe technologies, interface solutions, test engineering, and device characterization with Teradyne’s advanced automated test platforms

FormFactor and Teradyne Announce Strategic Collaboration to Accelerate Next-Generation Semiconductor Testing

Mon, 12 Oct 2026 16:01:00 -0400

FormFactor and Teradyne Announce Strategic Collaboration to Accelerate Next-Generation Semiconductor Testing

Mon, 12 Oct 2026 16:01:00 -0400

FormFactor and Teradyne Announce Strategic Collaboration to Accelerate Next-Generation Semiconductor Testing

Mon, 12 Oct 2026 16:01:00 -0400

Teradyne launches UltraFLEXplus S series for edge AI testing

Mon, 12 Oct 2026 09:02:21 -0400

Teradyne, Inc. (NASDAQ: TER) announced the launch of the UltraFLEXplus S series, a new line of semiconductor test systems designed for high-mix, variable-volume manufacturing targeting edge AI applications.

The first model, the UltraFLEXplus S24, is a 24-slot, single-module system intended for both engineering and production use. According to the company, it is aimed at integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSAT) providers.

The S series sits alongside the existing quad-module UltraFLEXplus Q series within Teradyne's UltraFLEXplus platform. The new system shares the same instrument module ecosystem, IG-XL software environment, and test program library as the Q series, allowing

Teradyne Introduces UltraFLEXplus S Series for Edge AI Applications

Mon, 12 Oct 2026 09:00:00 -0400

New Series of Testers Extend the UltraFLEXplus Architecture to Deliver Superior Floor Space Economics for High-Mix, Variable-Volume Manufacturing

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced the launch of the UltraFLEXplus S series, an extension of its UltraFLEXplus platform engineered to maximize output per square meter and operational efficiency for high-mix, variable-volume semiconductor manufacturing for edge AI applications. The first model, UltraFLEXplus S24, is a 24-slot system built for both engineering and production use, with particular emphasis on

Teradyne Introduces UltraFLEXplus S Series for Edge AI Applications

Mon, 12 Oct 2026 09:00:00 -0400

New Series of Testers Extend the UltraFLEXplus Architecture to Deliver Superior Floor Space Economics for High-Mix, Variable-Volume Manufacturing

Teradyne launches Titan HP platform with burn-in for AI chips

Tue, 06 Oct 2026 09:03:26 -0400

Teradyne, Inc. (NASDAQ: TER) announced the availability of its Titan HP platform with enhanced burn-in capabilities, targeting high-power AI, automotive, and other high-reliability semiconductor devices.

Unlike traditional burn-in, which holds devices in dedicated ovens at a controlled air temperature before functional testing, the Titan HP platform controls each device's junction temperature individually while running a realistic workload. The system's asynchronous slot architecture allows each slot to load and test independently, so a lengthy stress run on one device does not halt others, and individual sites can be serviced while the system remains operational.

The platform supports both system level test and reliability

Teradyne Introduces Titan HP Platform with Burn-In Capabilities for Advanced AI Data Center Devices

Tue, 06 Oct 2026 09:00:00 -0400

Chipmakers can lower cost of test, factory floor space, and time to market for high-power AI, automotive, and other high-reliability devices.

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced a production-ready system that delivers enhanced burn-in capabilities on its Titan™ HP platform. Traditional burn-in holds devices in banks of dedicated ovens at a controlled air temperature for hours before they move on to functional test. Teradyne Titan HP instead holds each device at its target junction temperature while

Teradyne Introduces Titan HP Platform with Burn-In Capabilities for Advanced AI Data Center Devices

Tue, 06 Oct 2026 09:00:00 -0400

Chipmakers can lower cost of test, factory floor space, and time to market for high-power AI, automotive, and other high-reliability devices.

Form 4 TERADYNE, INC For: Oct 01 Filed by: JOHNSON MERCEDES

Fri, 02 Oct 2026 12:45:00 -0400

si-local-file:///var/storage/secattach/20261002/27140691.html

Form 144 TERADYNE, INC Filed by: JOHNSON MERCEDES

Thu, 01 Oct 2026 11:52:00 -0400

si-local-file:///var/storage/secattach/20261001/27134051.html

Teradyne launches Magnum E2 memory test system for AI workloads

Tue, 29 Sep 2026 09:04:31 -0400

Teradyne, Inc. (NASDAQ: TER) announced the Magnum E2, a memory test system designed for advanced DRAM and flash interfaces, including LPDDR6, DDR6, GDDR7, and NAND flash.

The system is built on Teradyne's Near-DUT Test architecture, the same foundation used in its Magnum EPIC platform. Magnum E2 supports both production and engineering configurations on a shared hardware and software platform, covering qualification through high-volume manufacturing.

Key features include support for NRZ, PAM3, and PAM4 signaling, a programmable architecture intended to accommodate current and future DRAM and NAND standards, and built-in logic test capability designed to allow customers to consolidate test operations. The system

Teradyne Announces Magnum E2 to Address Next-Generation Memory Test Demands Driven by AI and High-Performance Computing

Tue, 29 Sep 2026 09:00:00 -0400

Advanced Near-DUT architecture delivers superior high-speed signal integrity, high parallelism, and a scalable and flexible test foundation for next-generation DRAM and NAND innovations.

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, announced Magnum E2, a next-generation high-speed memory test system for advanced DRAM and flash interfaces, including LPDDR6, DDR6, GDDR7, and NAND flash. Built on Teradyne's proven Near-DUT Test (NDT) architecture, the foundation of the widely deployed Magnum EPIC platform, Magnum E2 supports both production and engineering configurations, covering qualification

Teradyne Announces Magnum E2 to Address Next-Generation Memory Test Demands Driven by AI and High-Performance Computing

Tue, 29 Sep 2026 09:00:00 -0400

Advanced Near-DUT architecture delivers superior high-speed signal integrity, high parallelism, and a scalable and flexible test foundation for next-generation DRAM and NAND innovations.

StreetInsider.com News Articles

Form 144 TERADYNE, INC Filed by: Smith Gregory Stephen

Form 144 TERADYNE, INC Filed by: MATZ MARILYN

Teradyne to Announce Third Quarter 2026 Results

Teradyne to Announce Third Quarter 2026 Results

FormFactor stock rises on $300M Teradyne investment deal

FormFactor stock rises on $300M Teradyne investment deal

FormFactor stock rises on $300M Teradyne investment deal

FormFactor stock rises on $300M Teradyne investment deal

Teradyne to invest $300M in FormFactor in semiconductor test deal

Teradyne to invest $300M in FormFactor in semiconductor test deal

FormFactor and Teradyne Announce Strategic Collaboration to Accelerate Next-Generation Semiconductor Testing

FormFactor and Teradyne Announce Strategic Collaboration to Accelerate Next-Generation Semiconductor Testing

FormFactor and Teradyne Announce Strategic Collaboration to Accelerate Next-Generation Semiconductor Testing

FormFactor and Teradyne Announce Strategic Collaboration to Accelerate Next-Generation Semiconductor Testing

Teradyne launches UltraFLEXplus S series for edge AI testing

Teradyne Introduces UltraFLEXplus S Series for Edge AI Applications

Teradyne Introduces UltraFLEXplus S Series for Edge AI Applications

Teradyne launches Titan HP platform with burn-in for AI chips

Teradyne Introduces Titan HP Platform with Burn-In Capabilities for Advanced AI Data Center Devices

Teradyne Introduces Titan HP Platform with Burn-In Capabilities for Advanced AI Data Center Devices

Form 4 TERADYNE, INC For: Oct 01 Filed by: JOHNSON MERCEDES

Form 144 TERADYNE, INC Filed by: JOHNSON MERCEDES

Teradyne launches Magnum E2 memory test system for AI workloads

Teradyne Announces Magnum E2 to Address Next-Generation Memory Test Demands Driven by AI and High-Performance Computing

Teradyne Announces Magnum E2 to Address Next-Generation Memory Test Demands Driven by AI and High-Performance Computing